CM1242-33CP Datasheet, PDF (4/5 Pages) ON Semiconductor – 1-Channel ESD Protection Device in 0201 CSP

CM1242-33CP
CM1242-33CP Mechanical Specifications
The CM1242-33CP is supplied in a 2-bump Chip Scale Package (CSP).
Package
Bumps
Package Specifications
Custom CSP
2
Dim
A
B
C
C1
D
E
F
G
Millimeters
Inches
Min Nom Max Min Nom Max
0.195 0.215 0.235 0.00768 0.00846 0.00925
0.140 0.155 0.170 0.0055 0.0061 0.0067
0.360 REF
0.01417 REF
0.190 0.205 0.220 0.00748 0.00807 0.00866
0.570 0.600 0.630 0.02244 0.02362 0.02480
0.270 0.300 0.330 0.01063 0.01181 0.01299
0.250 0.275 0.300 0.00984 0.01083 0.01181
0.240 0.265 0.290 0.00945 0.01043 0.01142
Controlling dimension: millimeters
CM1242-33CP Chip Scale Package
CSP Tape and Reel Specifications
PART NUMBER CHIP SIZE (mm)
CM1242-33CP ^{0.600 X 0.300 X 0.275}
POCKET SIZE (mm) TAPE WIDTH
B₀ X A₀ X K₀
W
0.67 x 0.37 x 0.35
8mm
REEL
DIAMETER
178mm (7")
QTY PER
REEL
15,000
P₀
4mm
P₁
2mm
Tape and Reel Mechanical Data
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