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AX5042 Datasheet, PDF (39/42 Pages) ON Semiconductor – Advanced multi-channel single chip UHF transceiver
QFN28 Package Information 39
8.2. QFN28 Soldering Profile
Preheat
Tp
TL
TsMAX
TsMIN
ts
25°C
t25° to Peak
Time
Reflow
tp
Cooling
tL
Profile Feature
Average Ramp-Up Rate
Preheat Preheat
Temperature Min
Temperature Max
Time (TsMIN to TsMAX)
Time 25°C to Peak Temperature
Reflow Phase
Liquidus Temperature
Time over Liquidus Temperature
Peak Temperature
Time within 5°C of actual Peak
Temperature
Cooling Phase
Ramp-down rate
Pb-Free Process
3 °C/sec max.
TsMIN
TsMAX
ts
T25 ° to Peak
150°C
200°C
60 – 180 sec
8min max.
TL
217°C
tL
60 – 150 sec
tp
260°C
Tp
20 – 40 sec
6°C/sec max.
Notes:
All temperatures refer to the top side of the package, measured on the package body surface.
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AX5042