NSIC2030BT3G Datasheet, PDF (3/9 Pages) ON Semiconductor – Constant Current Regulator & LED Driver for A/C off-line Applications

NSIC2030BT3G
THERMAL CHARACTERISTICS
Characteristic
Symbol
Max
Unit
Total Device Dissipation (Note 1) T_A = 25°C
Derate above 25°C
P_D
1210
mW
8.0
mW/°C
Thermal Resistance, Junction−to−Ambient (Note 1)
Thermal Reference, Junction−to−Tab (Note 1)
Total Device Dissipation (Note 2) T_A = 25°C
Derate above 25°C
R_θJA
R_ψJL
P_D
124
17.5
1282
8.5
°C/W
°C/W
mW
mW/°C
Thermal Resistance, Junction−to−Ambient (Note 2)
Thermal Reference, Junction−to−Tab (Note 2)
Total Device Dissipation (Note 3) T_A = 25°C
Derate above 25°C
R_θJA
R_ψJL
P_D
117
18.2
1667
11.1
°C/W
°C/W
mW
mW/°C
Thermal Resistance, Junction−to−Ambient (Note 3)
Thermal Reference, Junction−to−Tab (Note 3)
Total Device Dissipation (Note 4) T_A = 25°C
Derate above 25°C
R_θJA
R_ψJL
P_D
90
16.4
1765
11.8
°C/W
°C/W
mW
mW/°C
Thermal Resistance, Junction−to−Ambient (Note 4)
Thermal Reference, Junction−to−Tab (Note 4)
Total Device Dissipation (Note 5) T_A = 25°C
Derate above 25°C
R_θJA
R_ψJL
P_D
85
16.7
1948
13
°C/W
°C/W
mW
mW/°C
Thermal Resistance, Junction−to−Ambient (Note 5)
Thermal Reference, Junction−to−Tab (Note 5)
Total Device Dissipation (Note 6) T_A = 25°C
Derate above 25°C
R_θJA
R_ψJL
P_D
77
15.5
2055
12.7
°C/W
°C/W
mW
mW/°C
Thermal Resistance, Junction−to−Ambient (Note 6)
Thermal Reference, Junction−to−Tab (Note 6)
Total Device Dissipation (Note 7) T_A = 25°C
Derate above 25°C
R_θJA
R_ψJL
P_D
73
15.6
2149
14.3
°C/W
°C/W
mW
mW/°C
Thermal Resistance, Junction−to−Ambient (Note 7)
Thermal Reference, Junction−to−Tab (Note 7)
Total Device Dissipation (Note 8) T_A = 25°C
Derate above 25°C
R_θJA
R_ψJL
P_D
69.8
14.8
2269
15.1
°C/W
°C/W
mW
mW/°C
Thermal Resistance, Junction−to−Ambient (Note 8)
Thermal Reference, Junction−to−Tab (Note 8)
Total Device Dissipation (Note 9) T_A = 25°C
Derate above 25°C
R_θJA
R_ψJL
P_D
66.1
14.8
2609
17.4
°C/W
°C/W
mW
mW/°C
Thermal Resistance, Junction−to−Ambient (Note 9)
Thermal Reference, Junction−to−Tab (Note 9)
Total Device Dissipation (Note 10) T_A = 25°C
Derate above 25°C
R_θJA
R_ψJL
P_D
57.5
13.9
2500
16.7
°C/W
°C/W
mW
mW/°C
Thermal Resistance, Junction−to−Ambient (Note 10)
Thermal Reference, Junction−to−Tab (Note 10)
Total Device Dissipation (Note 11) T_A = 25°C
Derate above 25°C
R_θJA
R_ψJL
P_D
60
16
3000
20
°C/W
°C/W
mW
mW/°C
Thermal Resistance, Junction−to−Ambient (Note 11)
Thermal Reference, Junction−to−Tab (Note 11)
R_θJA
50
°C/W
R_ψJL
16
°C/W
NOTE: Lead measurements are made by non−contact methods such as IR with treated surface to increase emissivity to 0.9.
Lead temperature measurement by attaching a T/C may yield values as high as 30% higher °C/W values based upon empirical
measurements and method of attachment.
1. 100 mm², 1 oz. Cu, still air.
2. 100 mm², 2 oz. Cu, still air.
3. 300 mm², 1 oz. Cu, still air.
4. 300 mm², 2 oz. Cu, still air.
5. 500 mm², 1 oz. Cu, still air.
6. 500 mm², 2 oz. Cu, still air.
7. 700 mm², 1 oz. Cu, still air.
8. 700 mm², 2 oz. Cu, still air.
9. 1000 mm², 3 oz. Cu, still air.
10. 400 mm², PCB is DENKA K1, 1.5 mm Al, 2kV Thermally conductive dielectric, 2 oz. Cu, or equivalent, still air.
11. 900 mm², PCB is DENKA K1, 1.5 mm Al, 2kV Thermally conductive dielectric, 2 oz. Cu, or equivalent, still air.
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