NSI50350AST3G_14 Datasheet, PDF (3/8 Pages) ON Semiconductor – Constant Current Regulator & LED Driver

NSI50350AST3G
THERMAL CHARACTERISTICS
Characteristic
Symbol
Max
Unit
Total Device Dissipation (Note 4) T_A = 25°C
Derate above 25°C
P_D
3112
mW
20.75
mW/°C
Thermal Resistance, Junction−to−Ambient (Note 4)
Thermal Reference, Junction−to−Tab (Note 4)
Total Device Dissipation (Note 5) T_A = 25°C
Derate above 25°C
R_θJA
R_ψJL
P_D
48.2
8.7
4225
28.17
°C/W
°C/W
mW
mW/°C
Thermal Resistance, Junction−to−Ambient (Note 5)
Thermal Reference, Junction−to−Tab (Note 5)
Total Device Dissipation (Note 6) T_A = 25°C
Derate above 25°C
R_θJA
R_ψJL
P_D
35.5
8.0
5119
34.13
°C/W
°C/W
mW
mW/°C
Thermal Resistance, Junction−to−Ambient (Note 6)
Thermal Reference, Junction−to−Tab (Note 6)
Total Device Dissipation (Note 7) T_A = 25°C
Derate above 25°C
R_θJA
R_ψJL
P_D
29.3
7.2
5859
39.06
°C/W
°C/W
mW
mW/°C
Thermal Resistance, Junction−to−Ambient (Note 7)
Thermal Reference, Junction−to−Tab (Note 7)
Total Device Dissipation (Note 8) T_A = 25°C
Derate above 25°C
R_θJA
R_ψJL
P_D
25.6
6.9
3061
20.41
°C/W
°C/W
mW
mW/°C
Thermal Resistance, Junction−to−Ambient (Note 8)
R_θJA
49
°C/W
Thermal Reference, Junction−to−Tab (Note 8)
R_ψJL
15.1
°C/W
NOTE: Lead measurements are made by non−contact methods such as IR with treated surface to increase emissivity to 0.9.
Lead temperature measurement by attaching a T/C may yield values as high as 30% higher °C/W values based upon empirical
measurements and method of attachment.
4. 400 mm², see below PCB description, still air.
5. 900 mm², see below PCB description, still air.
6. 1600 mm², see below PCB description, still air.
7. 2500 mm², see below PCB description, still air.
(For NOTES 4−7: PCB is DENKA K1, 1.5 mm Al, 2kV Thermally conductive dielectric, 2 oz. Cu, or equivalent).
8. 1000 mm², FR4, 3 oz Cu, still air.
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