MURF1620CT_06 Datasheet, PDF (3/4 Pages) ON Semiconductor – ULTRAFAST RECTIFIER 16 AMPERES, 200 VOLTS

MURF1620CT
TEST CONDITIONS FOR ISOLATION TESTS*
CLIP
MOUNTED
FULLY ISOLATED PACK-
AGE
LEADS
CLIP
MOUNTED
FULLY ISOLATED PACK-
AGE
0.099″ MIN
LEADS
MOUNTED
FULLY ISOLATED PACK-
AGE
0.099″ MIN
LEADS
HEATSINK
0.110, MIN
HEATSINK
Figure 3. Clip Mounting Position
for Isolation Test Number 1
Figure 4. Clip Mounting Position
for Isolation Test Number 2
* Measurement made between leads and heatsink with all leads shorted together.
HEATSINK
Figure 5. Screw Mounting Position
for Isolation Test Number 3
MOUNTING INFORMATION**
4−40 SCREW
PLAIN WASHER
CLIP
HEATSINK
COMPRESSION WASHER
NUT
HEATSINK
6a. Screw−Mounted
6b. Clip−Mounted
Figure 6. Typical Mounting Techniques
Laboratory tests on a limited number of samples indicate, when using the screw and compression washer mounting
technique, a screw torque of 6 to 8 in ^. lbs is sufficient to provide maximum power dissipation capability. The compression
washer helps to maintain a constant pressure on the package over time and during large temperature excursions.
Destructive laboratory tests show that using a hex head 4−40 screw, without washers, and applying a torque in excess of 20
in ^. lbs will cause the plastic to crack around the mounting hole, resulting in a loss of isolation capability.
Additional tests on slotted 4−40 screws indicate that the screw slot fails between 15 to 20 in ^. lbs without adversely affecting
the package. However, in order to positively ensure the package integrity of the fully isolated device, ON Semiconductor does
not recommend exceeding 10 in ^. lbs of mounting torque under any mounting conditions.
**For more information about mounting power semiconductors see Application Note AN1040.
http://onsemi.com
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