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MCR72-008 Datasheet, PDF (3/7 Pages) ON Semiconductor – Sensitive Gate Silicon Controlled Rectifiers | |||
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MCR72â3, MCR72â6, MCR72â8
THERMAL CHARACTERISTICS
Characteristic
Thermal Resistance, JunctionâtoâCase
Thermal Resistance, JunctionâtoâAmbient
Maximum Lead Temperature for Soldering Purposes 1/8â³ from Case for 10 Secs
Symbol
RqJC
RqJA
TL
Max
Unit
2.2
°C/W
60
°C/W
260
°C
ELECTRICAL CHARACTERISTICS (TC = 25°C unless otherwise noted.)
Characteristic
Symbol
Min Typ Max Unit
OFF CHARACTERISTICS
Peak Repetitive Forward or Reverse Blocking Current (Note 2)
(VAK = Rated VDRM or VRRM; RGK = 1 kW)
High Logic Level Supply Current from VCC
ON CHARACTERISTICS
TJ = 25°C
TJ = 110°C
IDRM, IRRM
â
â
10
mA
â
â
500
mA
ICCH
4
4
mA
mA
Peak Forward On-State Voltage
(ITM = 16 A Peak, Pulse Width p 1 ms, Duty Cycle p 2%)
VTM
â
1.7 2.0
V
Gate Trigger Current (Continuous dc) (Note 3)
(VD = 12 V, RL = 100 W)
IGT
â
30 200
mA
Gate Trigger Voltage (Continuous dc) (Note 3)
(VD = 12 V, RL = 100 W)
Gate NonâTrigger Voltage
(VD = 12 Vdc, RL = 100 W, TJ = 110°C)
Holding Current
(VD = 12 V, Initiating Current = 200 mA, RGK = 1 kW)
Gate Controlled Turn-On Time
(VD = Rated VDRM, ITM = 16 A, IG = 2 mA)
DYNAMIC CHARACTERISTICS
VGT
â
0.5 1.5
V
VGD
0.1
â
â
V
IH
â
â
6.0
mA
tgt
â
1.0
â
ms
Critical Rate-of-Rise of Off-State Voltage
(VD = Rated VDRM, RGK = 1 kW, TJ = 110°C, Exponential Waveform)
dv/dt
â
10
â
V/ms
2. Ratings apply for negative gate voltage or RGK = 1 kW. Devices shall not have a positive gate voltage concurrently with a negative voltage
on the anode. Devices should not be tested with a constant current source for forward and reverse blocking capability such that the
voltage applied exceeds the rated blocking voltage.
3. RGK current not included in measurement.
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