MC74VHCT139A_14 Datasheet, PDF (3/7 Pages) ON Semiconductor – Dual 2-to-4 Decoder/ Demultiplexer

MC74VHCT139A
MAXIMUM RATINGS
Symbol
Parameter
Value
Unit
V_CC
V_IN
V_OUT
I_IK
I_OK
I_OUT
I_CC
P_D
Positive DC Supply Voltage
Digital Input Voltage
DC Output Voltage
Input Diode Current
Output Diode Current
DC Output Current, per Pin
DC Supply Current, V_CC and GND Pins
Power Dissipation in Still Air
−0.5 to +7.0
V
−0.5 to +7.0
V
Output in 3−State
−0.5 to +7.0
V
High or Low State
−0.5 to V_CC +0.5
−20
mA
$20
mA
$25
mA
$75
mA
SOIC
200
mW
TSSOP
180
T_STG
V_ESD
Storage Temperature Range
ESD Withstand Voltage
−65 to +150
°C
Human Body Model (Note 1)
>2000
V
Machine Model (Note 2)
>200
Charged Device Model (Note 3)
>2000
I_LATCHUP Latchup Performance
Above V_CC and Below GND at 125°C (Note 4)
$300
mA
q_JA
Thermal Resistance, Junction−to−Ambient
SOIC
143
°C/W
TSSOP
164
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. Tested to EIA/JESD22−A114−A
2. Tested to EIA/JESD22−A115−A
3. Tested to JESD22−C101−A
4. Tested to EIA/JESD78
RECOMMENDED OPERATING CONDITIONS
Symbol
Characteristics
Min
Max
Unit
V_CC
V_IN
V_OUT
DC Supply Voltage
DC Input Voltage
DC Output Voltage Output in 3−State
High or Low State
4.5
5.5
V
0
5.5
V
0
5.5
V
0
V_CC
T_A
Operating Temperature Range, all Package Types
−55
125
°C
t_r, t_f
Input Rise or Fall Time
V_CC = 5.0 V + 0.5 V
0
20
ns/V
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
DEVICE JUNCTION TEMPERATURE VERSUS TIME
TO 0.1% BOND FAILURES
Junction
Temperature °C
Time, Hours
Time, Years
80
1,032,200
117.8
90
419,300
47.9
100
178,700
20.4
110
79,600
9.4
120
37,000
4.2
130
17,800
2.0
140
8,900
1.0
FAILURE RATE OF PLASTIC = CERAMIC
UNTIL INTERMETALLICS OCCUR
1
1
10
100
1000
TIME, YEARS
Figure 6. Failure Rate vs. Time Junction Temperature
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