MC74VHC244_11 Datasheet, PDF (3/8 Pages) ON Semiconductor – Octal Bus Buffer

MC74VHC244
RECOMMENDED OPERATING CONDITIONS
Symbol
Characteristics
V_CC
V_IN
V_OUT
T_A
t_r, t_f
DC Supply Voltage
DC Input Voltage
DC Output Voltage
Operating Temperature Range, all Package Types
Input Rise or Fall Time
Min
2.0
0
0
−55
V_CC = 3.3 V + 0.3 V
0
V_CC = 5.0 V + 0.5 V
Max
5.5
5.5
V_CC
125
100
20
Unit
V
V
V
°C
ns/V
DEVICE JUNCTION TEMPERATURE VERSUS
TIME TO 0.1% BOND FAILURES
Junction
Temperature °C
80
90
100
110
120
130
140
Time, Hours
1,032,200
419,300
178,700
79,600
37,000
17,800
8,900
Time, Years
117.8
47.9
20.4
9.4
4.2
2.0
1.0
FAILURE RATE OF PLASTIC = CERAMIC
UNTIL INTERMETALLICS OCCUR
1
1
10
100
1000
TIME, YEARS
Figure 2. Failure Rate vs. Time Junction Temperature
DC CHARACTERISTICS (Voltages Referenced to GND)
Symbol
Parameter
V_CC
Condition
(V)
V_IH
Minimum High−Level
Input Voltage
2.0
3.0 to
5.5
V_IL
Maximum Low−Level
Input Voltage
2.0
3.0 to
5.5
V_OH
Maximum High−Level V_IN = V_IH or V_IL
2.0
Output Voltage
I_OH = −50 mA
3.0
4.5
V_IN = V_IH or V_IL
I_OH = −4 mA
3.0
I_OH = −8 mA
4.5
V_OL
Maximum Low−Level V_IN = V_IH or V_IL
2.0
Output Voltage
I_OL = 50 mA
3.0
4.5
V_IN = V_IH or V_IL
I_OH = 4 mA
3.0
I_OH = 8 mA
4.5
I_IN
Input Leakage Current V_IN = 5.5 V or GND
0 to
5.5
I_OZ
Maximum 3−State
V_IN = V_IH or V_IL
5.5
Leakage Current
V_OUT = V_CC or GND
I_CC
Maximum Quiescent V_IN = V_CC or GND
5.5
Supply Current
(per package)
T_A = 25°C
Min Typ Max
1.5
V_CCX
0.7
0.5
V_CCX
0.3
1.9 2.0
2.9 3.0
4.4 4.5
2.58
3.94
0.0 0.1
0.0 0.1
0.0 0.1
0.36
0.36
±0.1
±0.25
4.0
T_A ≤ 85°C
Min Max
1.5
V_CCX
0.7
1.5
V_CCX
0.7
0.5
V_CCX
0.3
1.9
2.9
4.4
2.48
3.8
0.1
0.1
0.1
0.44
0.44
±1.0
±2.5
40.0
−55°C ≤ T_A ≤ 125°C
Min
Max Unit
1.5
V
V_CCX
0.7
0.5
V
V_CCX
0.3
1.9
V
2.9
4.4
2.34
3.66
0.1
V
0.1
0.1
0.52
0.52
±1.0 mA
±2.5 mA
40.0 mA
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