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MC74VHC157_11 Datasheet, PDF (3/7 Pages) ON Semiconductor – Quad 2-Channel Multiplexer
MC74VHC157
MAXIMUM RATINGS (Note 1)
Symbol
Parameter
Value
Unit
VCC
VI
VO
IIK
IOK
IO
ICC
TSTG
TL
TJ
qJA
PD
MSL
DC Supply Voltage
DC Input Voltage
DC Output Voltage
DC Input Diode Current
DC Output Diode Current
DC Output Sink Current
DC Supply Current per Supply Pin
Storage Temperature Range
Lead Temperature, 1 mm from Case for 10 Seconds
Junction Temperature under Bias
Thermal Resistance
Power Dissipation in Still Air at 85_C
Moisture Sensitivity
VI t GND
VO t GND
*0.5 to )7.0
*0.5 to VCC )7.0
*0.5 to VCC )7.0
*20
$20
$25
$100
*65 to )150
260
)150
250
250
Level 1
V
V
V
mA
mA
mA
mA
_C
_C
_C
_C/W
mW
FR
VESD
Flammability Rating
ESD Withstand Voltage
Oxygen Index: 30% − 35%
UL−94−VO (0.125 in)
Human Body Model (Note 2)
>2000
V
Machine Model (Note 3)
>200
Charged Device Model (Note 4)
N/A
ILatch−Up Latch−Up Performance
Above VCC and Below GND at 85_C (Note 5)
$500
mA
1. Absolute maximum continuous ratings are those values beyond which damage to the device may occur. Extended exposure to these
conditions or conditions beyond those indicated may adversely affect device reliability. Functional operation under absolute maximum−rated
conditions is not implied.
2. Tested to EIA/JESD22−A114−A.
3. Tested to EIA/JESD22−A115−A.
4. Tested to JESD22−C101−A.
5. Tested to EIA/JESD78.
RECOMMENDED OPERATING CONDITIONS
Symbol
Characteristics
Min
Max
VCC
DC Supply Voltage
2.0
5.5
VIN
DC Input Voltage
(Note 6) 0
5.5
VOUT
DC Output Voltage
0
VCC
TA
Operating Temperature Range, all Package Types
*55
125
tr, tf
Input Rise or Fall Time
VCC = 3.3 V $ 0.3 V
0
100
VCC = 5.0 V $ 0.5 V
0
20
6. Unused inputs may not be left open. All inputs must be tied to a high−logic voltage level or a low−logic input voltage level.
Unit
V
V
V
_C
ns/V
DEVICE JUNCTION TEMPERATURE VERSUS
TIME TO 0.1% BOND FAILURES
Junction
Temperature _C
Time, Hours
Time, Years
80
1,032,200
117.8
90
419,300
47.9
100
178,700
20.4
110
79,600
9.4
120
37,000
4.2
130
17,800
2.0
140
8,900
1.0
FAILURE RATE OF PLASTIC = CERAMIC
UNTIL INTERMETALLICS OCCUR
1
1
10
100
1000
TIME, YEARS
Figure 4. Failure Rate vs. Time Junction Temperature
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