MC74LVX4051_14 Datasheet, PDF (3/15 Pages) ON Semiconductor – Analog Multiplexer/ Demultiplexer

MC74LVX4051
MAXIMUM RATINGS
Symbol
Parameter
Value
Unit
V_EE Negative DC Supply Voltage
V_CC Positive DC Supply Voltage
V_IS Analog Input Voltage
V_IN Digital Input Voltage
I
DC Current, Into or Out of Any Pin
(Referenced to GND)
−7.0 to +0.5
V
(Referenced to GND)
0.5 to + 7.0
V
(Referenced to V_EE)
−0.5 to + 7.0
V_EE −0.5 to V_CC + 0.5
V
(Referenced to GND)
−0.5 to 7.0
V
±50
mA
T_STG
T_L
T_J
q_JA
Storage Temperature Range
Lead Temperature, 1 mm from Case for 10 Seconds
Junction Temperature under Bias
Thermal Resistance
SOIC
TSSOP
−65 to +150
260
+150
143
164
_C
_C
_C
°C/W
P_D
Power Dissipation in Still Air,
SOIC
500
mW
TSSOP
450
MSL Moisture Sensitivity
Level 1
F_R
V_ESD
Flammability Rating
ESD Withstand Voltage
Oxygen Index: 30% − 35% UL 94−V0 @ 0.125 in
Human Body Model (Note 1)
> 2000
V
Machine Model (Note 2)
> 200
Charged Device Model (Note 3)
> 1000
I_LATCHUP Latchup Performance
Above V_CC and Below GND at 125°C (Note 4)
±300
mA
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. Tested to EIA/JESD22−A114−A.
2. Tested to EIA/JESD22−A115−A.
3. Tested to JESD22−C101−A.
4. Tested to EIA/JESD78.
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
Min
Max
V_EE Negative DC Supply Voltage
(Referenced to GND) −6.0
GND
V_CC Positive DC Supply Voltage
(Referenced to GND)
2.5
6.0
(Referenced to V_EE)
2.5
6.0
V_IS Analog Input Voltage
V_EE
V_CC
V_IN Digital Input Voltage
(Note 5) (Referenced to GND)
0
6.0
T_A
Operating Temperature Range, All Package Types
−55
125
t_r, t_f Input Rise/Fall Time
(Channel Select or Enable Inputs)
V_CC = 3.0 V $ 0.3 V
0
100
V_CC = 5.0 V $ 0.5 V
0
20
5. Unused inputs may not be left open. All inputs must be tied to a high−logic voltage level or a low−logic input voltage level.
Unit
V
V
V
V
_C
ns/V
DEVICE JUNCTION TEMPERATURE VERSUS
TIME TO 0.1% BOND FAILURES
Junction
Temperature °C
Time, Hours
Time, Years
80
1,032,200
117.8
90
419,300
47.9
100
178,700
20.4
110
79,600
9.4
120
37,000
4.2
130
17,800
2.0
140
8,900
1.0
FAILURE RATE OF PLASTIC = CERAMIC
UNTIL INTERMETALLICS OCCUR
1
1
10
100
1000
TIME, YEARS
Figure 3. Failure Rate vs. Time Junction Temperature
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