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MC74LVX32_14 Datasheet, PDF (3/5 Pages) ON Semiconductor – Quad 2-Input OR Gate | |||
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MC74LVX32
AC ELECTRICAL CHARACTERISTICS (Input tr = tf = 3.0ns)
TA = 25°C
TA = â40 to 85°C
Symbol
Parameter
Test Conditions
Min
Typ
Max
Min
Max
Unit
tPLH,
tPHL
Propagation Delay, Input to VCC = 2.7V
Output
CL = 15pF
CL = 50pF
5.8
10.7
1.0
8.3
14.2
1.0
13.5
ns
17.0
VCC = 3.3 ± 0.3V
CL = 15pF
CL = 50pF
4.4
6.6
1.0
8.0
6.9
10.1
1.0
11.5
tOSHL OutputâtoâOutput Skew
tOSLH (Note 1)
VCC = 2.7V
VCC = 3.3 ±0.3V
CL = 50pF
CL = 50pF
1.5
1.5
ns
1.5
1.5
1. Skew is defined as the absolute value of the difference between the actual propagation delay for any two separate outputs of the same device.
The specification applies to any outputs switching in the same direction, either HIGHâtoâLOW (tOSHL) or LOWâtoâHIGH (tOSLH); parameter
guaranteed by design.
CAPACITIVE CHARACTERISTICS
Symbol
Parameter
TA = 25°C
TA = â40 to 85°C
Min
Typ
Max
Min
Max
Unit
Cin Input Capacitance
4
10
10
pF
CPD Power Dissipation Capacitance (Note 2)
14
pF
2. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load.
Average operating current can be obtained by the equation: ICC(OPR) = CPD VCC fin + ICC / 4 (per gate). CPD is used to determine the
noâload dynamic power consumption; PD = CPD VCC2 fin + ICC VCC.
NOISE CHARACTERISTICS (Input tr = tf = 3.0ns, CL = 50pF, VCC = 3.3V, Measured in SOIC Package)
TA = 25°C
Symbol
Characteristic
Typ
Max
Unit
VOLP Quiet Output Maximum Dynamic VOL
0.3
0.5
V
VOLV Quiet Output Minimum Dynamic VOL
â0.3 â0.5
V
VIHD Minimum High Level Dynamic Input Voltage
2.0
V
VILD Maximum Low Level Dynamic Input Voltage
0.8
V
A or B
50%
O
tPLH
50% VCC
VCC
GND
tPHL
Figure 2. Switching Waveforms
DEVICE
UNDER
TEST
TEST POINT
OUTPUT
CL*
*Includes all probe and jig capacitance
Figure 3. Test Circuit
ORDERING INFORMATION
Device
Package
Shippingâ
MC74LVX32DR2G
SOICâ14 NB
(PbâFree)
2500 Tape & Reel
MC74LVX32DTR2G
TSSOPâ14
(PbâFree)
2500 Tape & Reel
â For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
http://onsemi.com
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