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MC74HC4851A_11 Datasheet, PDF (3/15 Pages) ON Semiconductor – Analog Multiplexers/Demultiplexers with Injection Current Effect Control | |||
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MC74HC4851A, MC74HC4852A
ÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃ MAXIMUM RATINGS
ÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃ Symbol
Parameter
Value
Unit
ÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃ VCC Positive DC Supply Voltage (Referenced to GND) â0.5 to + 7.0
V
ÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃ Vin DC Input Voltage (Any Pin) (Referenced to GND) â0.5 to VCC + 0.5 V
ÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃ I
DC Current, Into or Out of Any Pin
$25
mA
ÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃ PD Power Dissipation in Still Air,
Plastic DIPâ
750
mW
SOIC Packageâ
500
ÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃ TSSOP Packageâ
450
ÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃ Tstg Storage Temperature Range
â65 to + 150
°C
ÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃ TL Lead Temperature, 1 mm from Case for 10 Seconds
°C
ÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃ Plastic DIP, SOIC or TSSOP Package
260
ÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃ Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress
ratings only. Functional operation above the Recommended Operating Conditions is not implied.
Extended exposure to stresses above the Recommended Operating Conditions may affect device
reliability.
â Derating â Plastic DIP: â 10 mW/°C from 65° to 125°C
SOIC Package: â 7 mW/°C from 65° to 125°C
TSSOP Package: â 6.1 mW/°C from 65° to 125°C
This device contains protection
circuitry to guard against damage
due to high static voltages or electric
fields. However, precautions must
be taken to avoid applications of any
voltage higher than maximum rated
voltages to this highâimpedance cir-
cuit. For proper operation, Vin and
Vout should be constrained to the
range GND v (Vin or Vout) v VCC.
Unused inputs must always be
tied to an appropriate logic voltage
level (e.g., either GND or VCC).
Unused outputs must be left open.
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
Min
Max Unit
VCC Positive DC Supply Voltage (Referenced to GND) 2.0
6.0
V
Vin DC Input Voltage (Any Pin) (Referenced to GND) GND
VCC
V
VIO* Static or Dynamic Voltage Across Switch
0.0
1.2
V
TA Operating Temperature Range, All Package Types
â 55 + 125 °C
tr, tf Input Rise/Fall Time
VCC = 2.0 V
0
(Channel Select or Enable Inputs) VCC = 4.5 V
0
VCC = 6.0 V
0
1000 ns
500
400
*For voltage drops across switch greater than 1.2 V (switch on), excessive VCC current may be
drawn; i.e., the current out of the switch may contain both VCC and switch input components. The
reliability of the device will be unaffected unless the Maximum Ratings are exceeded.
DC CHARACTERISTICS â Digital Section (Voltages Referenced to GND) VEE = GND, Except Where Noted
Symbol
Parameter
Condition
Guaranteed Limit
VCC
V â55 to 25°C â¤85°C â¤125°C Unit
VIH Minimum HighâLevel Input Voltage,
ChannelâSelect or Enable Inputs
Ron = Per Spec
2.0
1.50
1.50 1.50
V
3.0
2.10
2.10 2.10
4.5
3.15
3.15 3.15
6.0
4.20
4.20 4.20
VIL Maximum LowâLevel Input Voltage,
ChannelâSelect or Enable Inputs
Ron = Per Spec
2.0
0.50
0.50 0.50
V
3.0
0.90
0.90 0.90
4.5
1.35
1.35 1.35
6.0
1.80
1.80 1.80
Iin
Maximum Input Leakage Current on Digital Pins Vin = VCC or GND
(Enable/A/B/C)
6.0
± 0.1
± 1.0 ± 1.0 mA
ICC Maximum Quiescent Supply Current
(per Package)
Vin(digital) = VCC or GND 6.0
2
Vin(analog) = GND
20
40
mA
http://onsemi.com
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