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MC74HC164B Datasheet, PDF (3/9 Pages) ON Semiconductor – 8-Bit Serial-Input/Parallel- Output Shift Register
MC74HC164B
MAXIMUM RATINGS
Symbol
Parameter
Value
Unit
VCC DC Supply Voltage (Referenced to GND)
– 0.5 to + 7.0
V
Vin DC Input Voltage (Referenced to GND)
– 0.5 to VCC + 0.5 V
Vout DC Output Voltage (Referenced to GND)
– 0.5 to VCC + 0.5 V
Iin
DC Input Current, per Pin
± 20
mA
Iout DC Output Current, per Pin
± 25
mA
ICC DC Supply Current, VCC and GND Pins
± 50
mA
PD Power Dissipation in Still Air,
SOIC Package†
500
mW
TSSOP Package†
450
Tstg Storage Temperature
– 65 to + 150
_C
TL Lead Temperature, 1 mm from Case for 10 Seconds
_C
(SOIC or TSSOP Package)
260
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any
of these limits are exceeded, device functionality should not be assumed, damage may occur
and reliability may be affected.
†Derating — SOIC Package: – 7 mW/_C from 65_ to 125_C
TSSOP Package: − 6.1 mW/_C from 65_ to 125_C
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
Min
Max Unit
VCC
Vin, Vout
DC Supply Voltage (Referenced to GND)
DC Input Voltage, Output Voltage (Referenced to
GND)
2.0
6.0
V
0
VCC
V
TA Operating Temperature, All Package Types
– 55 + 125 _C
tr, tf Input Rise and Fall Time
(Figure 1)
VCC = 2.0 V
0
No Limit ns
VCC = 4.5 V
0
No Limit
VCC = 6.0 V
0
No Limit
Functional operation above the stresses listed in the Recommended Operating Ranges is not
implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may
affect device reliability.
This device contains protection
circuitry to guard against damage
due to high static voltages or electric
fields. However, precautions must
be taken to avoid applications of any
voltage higher than maximum rated
voltages to this high−impedance cir-
cuit. For proper operation, Vin and
Vout should be constrained to the
range GND v (Vin or Vout) v VCC.
Unused inputs must always be
tied to an appropriate logic voltage
level (e.g., either GND or VCC).
Unused outputs must be left open.
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