LV2241PQA Datasheet, PDF (3/9 Pages) ON Semiconductor – FM Splitter IC

LV2241PQA
Package Dimensions
unit : mm
QFN16 3x3, 0.5P
PIN 1
LOCATION
D
A
B
E
0.15 C
0.15 C
0.10 C
TOP VIEW
(A3)
0.08 C
NOTE 4
SIDE VIEW
A1
D2
16X L
DETAIL A
5
8
4
16X _K
1
9
E2
12
16
13
16X b
0.10 C A B
e
0.05 C NOTE 3
e/2
BOTTOM VIEW
L
DETAIL A
ALTERNATE TERMINAL
CONSTRUCTIONS
A
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.25 AND 0.30 MM FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
5. OUTLINE MEETS JEDEC DIMENSIONS PER
MO−220, VARIATION VEED−6.
MILLIMETERS
DIM MIN MAX
A 0.80 1.00
A1 0.00 0.05
A3
0.20 REF
b 0.18 0.30
D
3.00 BSC
D2 1.25 1.55
E
3.00 BSC
E2 1.25 1.55
e
0.50 BSC
K 0.20 −−−
L 0.30 0.50
C
SEATING
PLANE
RECOMMENDED
SOLDERING FOOTPRINT*
PACKAGE
OUTLINE
3.30
16X
0.65
1
3.30
16X
0.30
0.50
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
www.onsemi.com
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