LB11862MC Datasheet, PDF (3/6 Pages) ON Semiconductor – Fan Motor Driver Single-Phase, Full-Wave

LB11862MC
Package Dimensions
unit : mm
SOIC−10 NB
CASE 751BQ
ISSUE B
D
H
0.20 C
2X 5 TIPS
0.10 C
A
A1
2X
D
A
10
6
1
5
B
TOP VIEW
e
SIDE VIEW
0.10 C A-B
2X
0.10 C A-B
F
E
L2
10X b
0.25 M C A-B D
A3
L
DETAIL A
C
SEATING
PLANE
10X
h
0.10 C
X 45
M
C
SEATING
PLANE
DETAIL A
END VIEW
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE PROTRUSION
SHALL BE 0.10mm TOTAL IN EXCESS OF ’b’
AT MAXIMUM MATERIAL CONDITION.
4. DIMENSIONS D AND E DO NOT INCLUDE
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS. MOLD FLASH, PROTRUSIONS, OR
GATE BURRS SHALL NOT EXCEED 0.15mm
PER SIDE. DIMENSIONS D AND E ARE DE-
TERMINED AT DATUM F.
5. DIMENSIONS A AND B ARE TO BE DETERM-
INED AT DATUM F.
6. A1 IS DEFINED AS THE VERTICAL DISTANCE
FROM THE SEATING PLANE TO THE LOWEST
POINT ON THE PACKAGE BODY.
MILLIMETERS
DIM MIN MAX
A 1.25 1.75
A1 0.10 0.25
A3 0.17 0.25
b 0.31 0.51
D 4.80 5.00
E 3.80 4.00
e
1.00 BSC
H 5.80 6.20
h
0.37 REF
L 0.40 0.80
L2
0.25 BSC
M
0
8
RECOMMENDED
SOLDERING FOOTPRINT*
10X 0.58
1.00
PITCH
6.50
10X 1.18
1
DIMENSION: MILLIMETERS
www.onsemi.com
3