CAT6500 Datasheet, PDF (3/13 Pages) ON Semiconductor – 3.0 A Power Selector Switch

CAT6500
Table 1. PIN FUNCTION DESCRIPTION
Pin No.
Pin Name
Description
1, 2, 3, 4
PWR_OUT Power Output. Must be tied to PWR_OUT on opposite side of chip. Use all 3 pins each side.
5
NIC
No Internal Connection. A signal or voltage applied to this pin will have no effect on device operation.
6, 7, 8, 9, 10
PS2
Power Source #2. External power input
11, 12
NIC
No Internal Connection. A signal or voltage applied to this pin will have no effect on device operation.
13
VCC
Power input from battery.
14
GND
Ground. Reference point for all voltages.
15
C1
Filter capacitor for CAT6500’s internal power bus
16
NIC
No Internal Connection. A signal or voltage applied to this pin will have no effect on device operation.
17
NIC
No Internal Connection. A signal or voltage applied to this pin will have no effect on device operation.
18
PRIORITY Priority selects preferred power source when both PS1 and PS2 are powered.
19
RM_EN2
Reverse Mode Enable 2. Overrides PRIORITY and turns SW2 ON.
20
GND
Ground. Reference point for all voltages.
21
RM_EN1
Reverse Mode Enable 1. Overrides PRIORITY and turns SW1 ON.
22
PS1
Power Source #1. External power input.
23
SW2_STAT Power Source 2 Status. An open drain LOW true logic level output indicating that the switch SW2 is
turned on.
24
SW1_STAT Power Source 1 Status. An open drain LOW true logic level output indicating that the switch SW1 is
turned on.
25, 26, 27, 28
PS1
Power Source #1. External power input.
29
NIC
No Internal Connection. A signal or voltage applied to this pin will have no effect on device operation.
30, 31, 32
PWR_OUT Power Output. Must be tied to PWR_OUT on opposite side of chip. Use all 3 pins each side.
33
PWR_OUT Electrically active thermal pad. Does not need to be connected to other PWR_OUTs. Can be left float-
ing but must not be connected to other signal paths or Ground.
34
PS2
Electrically active thermal pad. Does not need to be connected to other PS2 pins. Can be left floating
but must not be connected to other signal paths or Ground.
35
–
Mechanical support for control IC. This chip does not generate any significant heat and does not need
a separate heat sinking connection. Electrically this may be left floating or can be grounded. It should
NOT be connected to other signals or voltages.
36
PS1
Electrically active thermal pad. Does not need to be connected to other PS1 pins. Can be left floating
but must not be connected to other signal paths or Ground.
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