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CAT34C02_11 Datasheet, PDF (3/14 Pages) ON Semiconductor – 2 kb I2C EEPROM for DDR2 DIMM Serial Presence Detect TSSOP−8 Y SUFFIX
CAT34C02
Table 5. A.C. CHARACTERISTICS (VCC = 1.7 V to 5.5 V, TA = −40°C to +85°C) (Note 6)
Standard
Symbol
Parameter
Min
Max
FSCL
Clock Frequency
tHD:STA
START Condition Hold Time
4
tLOW
Low Period of SCL Clock
4.7
tHIGH
High Period of SCL Clock
4
tSU:STA
START Condition Setup Time
4.7
tHD:DAT
Data Hold Time
0
tSU:DAT
Data Setup Time
250
tR (Note 7)
SDA and SCL Rise Time
tF (Note 7)
SDA and SCL Fall Time
tSU:STO
STOP Condition Setup Time
4
tBUF
Bus Free Time Between STOP and START
4.7
tAA
SCL Low to SDA Data Out
tDH
Data Out Hold Time
100
Ti (Note 7)
Noise Pulse Filtered at SCL and SDA Inputs
tSU:WP
WP Setup Time
0
tHD:WP
WP Hold Time
2.5
tWR
Write Cycle Time
tPU (Notes 7 & 8) Power−up to Ready Mode
6. Test conditions according to “A.C. Test Conditions” table.
7. Tested initially and after a design or process change that affects this parameter.
8. tPU is the delay between the time VCC is stable and the device is ready to accept commands.
100
1000
300
3.5
100
5
1
Fast
Min
Max
400
0.6
1.3
0.6
0.6
0
100
300
300
0.6
1.3
0.9
100
100
0
2.5
5
1
Units
kHz
ms
ms
ms
ms
ms
ns
ns
ns
ms
ms
ms
ns
ns
ms
ms
ms
ms
Table 6. THERMAL CHARACTERISTICS (Air velocity = 0 m/s, 4 layers PCB) (Notes 9 and 10)
CAT34C02Y
Part Number
Package
TSSOP
qJA
qJC
64
37
CAT34C02VP2
TDFN
92
15
CAT34C02HU3
UDFN
101
18
CAT34C02HU4
UDFN
101
18
9. TJ = TA + PD * qJA, where: TJ is the Junction Temperature, TA the Ambient Temperature, PD the Power dissipation.
Example: CAT34C02VP2, VCC = 3.0 V, ICCmax = 1 mA, TA = 85°C: TJ = 85°C + 3 mW * 92°C/W = 85.276°C.
10. TJ = TC + PD * qJC, where: TC is the Case Temperature, etc.
Units
°C/W
°C/W
°C/W
°C/W
Table 7. A.C. TEST CONDITIONS
Input Levels
Input Rise and Fall Times
0.2 VCC to 0.8 VCC
≤ 50 ns
Input Reference Levels
Output Reference Levels
Output Load
0.3 VCC, 0.7 VCC
0.5 VCC
Current Source: IOL = 3 mA (VCC ≥ 2.5 V); IOL = 1 mA (VCC < 2.5 V); CL = 100 pF
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