English
Language : 

CAT3200_14 Datasheet, PDF (3/12 Pages) ON Semiconductor – Low Noise Regulated Charge Pump DC-DC Converter
CAT3200, CAT3200−5
Table 3. RECOMMENDED OPERATING CONDITIONS
Parameters
Ratings
Units
VIN
CIN, COUT, CFLY
ILOAD
Ambient Temperature Range
2.7 to 4.5
V
1
mF
0 to 100
mA
−40 to +85
°C
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
Table 4. ELECTRICAL SPECIFICATIONS
(Recommended operating conditions unless otherwise specified. CIN, COUT, CFLY are 1 mF ceramic capacitors and VIN is set to 3.6 V.)
Symbol
Parameter
Conditions
Min
Typ
Max
Units
VOUT
VLINE
VLOAD
FOSC
VR
Regulated Output
Line Regulation
Load Regulation
Switching Frequency
Output Ripple Voltage
ILOAD ≤ 40 mA, VIN ≥ 2.7 V
ILOAD ≤ 100 mA, VIN ≥ 3.1 V
4.8
5.0
5.2
V
3.1 V ≤ VIN ≤ 4.5 V, ILOAD = 50 mA
6
mV
ILOAD = 10 mA to 100 mA, VIN = 3.6 V
20
mV
1.3
2.0
2.6
MHz
ILOAD = 100 mA
CAT3200−5 Only
30
mVp−p
h
Efficiency
ILOAD = 50 mA, VIN = 3 V, CAT3200−5
80
%
IGND
Ground Current
ILOAD = 0 mA, SHDN = VIN
1.6
4
mA
ISHDN
Shutdown Input Current
ILOAD = 0 mA, SHDN = 0 V
1
mA
VFB
FB Voltage
CAT3200 Only
1.22 1.27 1.32
V
IFB
FB Input Current
CAT3200 Only
−50
50
nA
ROL
Open−Loop Resistance
ILOAD = 100 mA, VIN = 3 V (Note 1)
10
W
TON
VOUT Turn−on time (10% to 90%)
ILOAD = 0 mA, VIN = 3 V
0.5
ms
VIHSHDN
High Detect Shutdown Threshold
0.8
1.3
V
VILSHDN
Low Detect Shutdown Threshold
0.4
V
IROUT
Reverse Leakage into OUT pin
VOUT = 5 V, Shutdown mode (Note 2)
15
30
mA
ISC
Short−circuit Output
VOUT = 0 V
80
mA
TSD
Thermal Shutdown
160
°C
THYST
Thermal Hysteresis
20
°C
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
1. ROL = (2VIN − VOUT)/IOUT
2. In the event of a controlled shutdown, the output will be isolated from the input, but will remain connected to the internal resistor feedback
network. This will cause a small level of reverse current to flow back into the device to ground.
http://onsemi.com
3