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AMIS30660NGA Datasheet, PDF (3/10 Pages) ON Semiconductor – High Speed CAN Transceiver | |||
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AMISâ30660
Table 3. ABSOLUTE MAXIMUM RATINGS
Symbol
Parameter
Conditions
Min
Max
Unit
VCC
VCANH
Supply Voltage
DC Voltage at Pin CANH
0 < VCC < 5.25 V;
No Time Limit
â0.3
+7
V
â45
+45
V
VCANL
DC Voltage at Pin CANL
0 < VCC < 5.25 V;
No Time Limit
â45
+45
V
VTxD
VRxD
VS
Vref
Vtran(CANH)
Vtran(CANL)
Vesd
DC Voltage at Pin TxD
DC Voltage at Pin RxD
DC Voltage at Pin S
DC Voltage at Pin VREF
Transient Voltage at Pin CANH
Transient Voltage at Pin CANL
Electrostatic Discharge Voltage at All Pins
(Note 2)
(Note 2)
(Note 3)
(Note 5)
â0.3 VCC + 0.3
V
â0.3 VCC + 0.3
V
â0.3 VCC + 0.3
V
â0.3 VCC + 0.3
V
â150
+150
V
â150
+150
V
â4
+4
kV
â500
+500
V
Latchup
Static Latchup at All Pins
(Note 4)
100
mA
Tstg
Storage Temperature
â55
+155
°C
Tamb
Ambient Temperature
â40
+125
°C
TJunc
Maximum Tunction Temperature
â40
+150
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
2. Applied transient waveforms in accordance with ISO 7637 part 3, test pulses 1, 2, 3a, and 3b (see Figure 4).
3. Standardized human body model ESD pulses in accordance to MIL883 method 3015.7.
4. Static latchâup immunity: static latchâup protection level when tested according to EIA/JESD78.
5. Standardized charged device model ESD pulses when tested according to EOS/ESD DS5.3â1993.
Table 4. THERMAL CHARACTERISTICS
Symbol
Parameter
Rth(vjâa)
Thermal Resistance from JunctionâtoâAmbient in SOICâ8
Package
Rth(vjâs)
Thermal resistance from JunctionâtoâSubstrate of Bare Die
Conditions
In Free Air
In Free Air
Value
Unit
150
K/W
45
K/W
VBAT
IN
OUT
5Vâreg
VCC
CAN
controller
PC20040918.2
GND
S
8
RxD
4
TxD
1
VCC
3
7 CANH
AMISâ
30660
5 Vref
6 CANL
2
GND
60 W 60 W
47 nF
CAN
BUS
60 W
60 W
47 nF
Figure 2. Application Diagram
http://onsemi.com
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