B300W35A102XYG Datasheet, PDF (28/31 Pages) ON Semiconductor – Audio Processor for Portable Communication Devices DFN−44 D SUFFIX

BelaSigna 300
8.9 x 5 mm DFN
ON Semiconductor offers tape and reel packing for BelaSigna 300 DFN. The packing consists of a pocketed carrier tape,
a cover tape, and a molded anti−static polystyrene reel. The carrier and cover tape create an ESD safe environment, protecting
the components from physical and electrostatic damage during shipping and handling.
Pin 1
Quantity per Reel: 2500 units
Pin 1 Orientation: Upper Left
Tape Brand / Width: C−PAK / 16 mm
Pocket Pitch: 8 mm
P/N: QFN0500X0890
Cover Tape: Sumitomo 13.3 mm (Z7302−13.3)
A = 13 inches
B = 16 mm
C = 4 inches
D = 14 mm
Reel Brand / Width: PEAK / 13 in
Figure 18. Package Orientation on Tape for DFN Package Option
Figure 19. DFN Carrier Tape Drawing
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