NCP4523 Datasheet, PDF (23/24 Pages) ON Semiconductor – CMOS 3CH-LDOs for RF Unit

NCP4523
PACKAGE DIMENSIONS
E
8
−X−
5
−Y−
BL
1
4
H
A
SSOP−8
G SUFFIX
CASE 487−01
ISSUE O
K
C
G
NOTE 3 D 8 PL
0.15 (0.006) M T X Y
0.10 (0.004)
−T− _SEATING
PLANE
F
J
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION D APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.25 AND 0.30 MM
FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED PAD
AS WELL AS THE TERMINALS.
INCHES
DIM MIN MAX
A 0.106 0.122
B 0.102 0.118
C 0.039 0.051
D 0.004 0.012
E 0.073 0.081
F 0.012 0.024
G 0.026 TYP
H 0.019 TYP
J 0.004 0.006
K 0.000 0.008
L 0.150 0.165
MILLIMETERS
MIN MAX
2.70 3.10
2.60 3.00
1.00 1.30
0.10 0.30
1.85 2.05
0.30 0.60
0.65 TYP
0.475 TYP
0.11 0.14
0.00 0.20
3.80 4.20
SOLDERING FOOTPRINT* _{1.465 mm}
0.38 mm
0.65 mm
2.32 mm
5.28 mm
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
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