English
Language : 

NVD5865NLT4G Datasheet, PDF (2/6 Pages) ON Semiconductor – Power MOSFET 60 V, 46 A, 16 m, Single N−Channel
NVD5865NL
ELECTRICAL CHARACTERISTICS (TJ = 25°C unless otherwise noted)
Parameter
Symbol
Test Condition
Min
OFF CHARACTERISTICS
Drain−to−Source Breakdown Voltage
V(BR)DSS
VGS = 0 V, ID = 250 mA
60
Drain−to−Source Breakdown Voltage V(BR)DSS/TJ
Temperature Coefficient
Zero Gate Voltage Drain Current
Gate−to−Source Leakage Current
ON CHARACTERISTICS (Note 4)
Gate Threshold Voltage
Negative Threshold Temperature
Coefficient
IDSS
IGSS
VGS(TH)
VGS(TH)/TJ
VGS = 0 V,
VDS = 60 V
TJ = 25°C
TJ = 125°C
VDS = 0 V, VGS = ±20 V
VGS = VDS, ID = 250 mA
1.0
Drain−to−Source On Resistance
Drain−to−Source on Resistance
Forward Transconductance
RDS(on)
RDS(on)
gFS
CHARGES, CAPACITANCES AND GATE RESISTANCES
VGS = 10 V, ID = 19 A
VGS = 4.5 V, ID = 19 A
VDS = 15 V, ID = 19 A
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Total Gate Charge
Threshold Gate Charge
Gate−to−Source Charge
Gate−to−Drain Charge
Total Gate Charge
Ciss
Coss
Crss
QG(TOT)
QG(TH)
QGS
QGD
QG(TOT)
Gate Resistance
RG
SWITCHING CHARACTERISTICS (Note 5)
VGS = 0 V, f = 1.0 MHz,
VDS = 25 V
VGS = 10 V, VDS = 48 V,
ID = 38 A
VGS = 4.5 V, VDS = 48 V,
ID = 38 A
Turn−On Delay Time
Rise Time
Turn−Off Delay Time
Fall Time
td(on)
tr
td(off)
tf
VGS = 10 V, VDD = 48 V,
ID = 38 A, RG = 2.5 W
DRAIN−SOURCE DIODE CHARACTERISTICS
Forward Diode Voltage
Reverse Recovery Time
Charge Time
Discharge Time
VSD
VGS = 0 V,
TJ = 25°C
IS = 38 A
TJ = 125°C
tRR
ta
VGS = 0 V, dIs/dt = 100 A/ms,
tb
IS = 38 A
Reverse Recovery Charge
QRR
4. Pulse Test: Pulse Width ≤ 300 ms, Duty Cycle ≤ 2%.
5. Switching characteristics are independent of operating junction temperatures.
Typ
Max
Unit
V
55
mV/°C
1.0
mA
100
±100
nA
2.0
V
5.6
mV/°C
13
16
mW
16
19
mW
15
S
1400
pF
137
95
29
nC
1.1
4
8
15
nC
1.3
W
8.4
ns
12.4
26
4.4
0.95
1.2
V
0.85
20
ns
13
7
13
nC
http://onsemi.com
2