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NTB6411AN Datasheet, PDF (2/7 Pages) ON Semiconductor – N-Channel Power MOSFET 100 V, 72 A, 14 mΩ
NTB6411AN, NTP6411AN
ELECTRICAL CHARACTERISTICS (TJ = 25°C Unless otherwise specified)
Characteristics
Symbol
Test Condition
Min
Typ
Max Unit
OFF CHARACTERISTICS
Drain−to−Source Breakdown Voltage
Drain−to−Source Breakdown Voltage Temper-
ature Coefficient
V(BR)DSS
V(BR)DSS/TJ
VGS = 0 V, ID = 250 mA
100
113
V
mV/°C
Zero Gate Voltage Drain Current
Gate−to−Source Leakage Current
ON CHARACTERISTICS (Note 2)
IDSS
IGSS
VGS = 0 V,
VDS = 100 V
TJ = 25°C
TJ = 125°C
VDS = 0 V, VGS = $20 V
1.0
mA
100
$100 nA
Gate Threshold Voltage
VGS(th)
Negative Threshold Temperature Coefficient
VGS(th)/TJ
Drain−to−Source On−Resistance
RDS(on)
Forward Transconductance
gFS
CHARGES, CAPACITANCES & GATE RESISTANCE
VGS = VDS, ID = 250 mA
VGS = 10 V, ID = 72 A
VDS = 5 V, ID = 10 A
2.0
4.0
V
8.6
mV/°C
12.7
14
mW
24
S
Input Capacitance
Ciss
Output Capacitance
Coss
Reverse Transfer Capacitance
Crss
Total Gate Charge
QG(TOT)
Threshold Gate Charge
QG(TH)
Gate−to−Source Charge
QGS
Gate−to−Drain Charge
QGD
Plateau Voltage
VGP
Gate Resistance
RG
SWITCHING CHARACTERISTICS, VGS = 10 V (Note 3)
Turn−On Delay Time
td(on)
Rise Time
tr
Turn−Off Delay Time
td(off)
Fall Time
tf
DRAIN−SOURCE DIODE CHARACTERISTICS
VDS = 25 V, VGS = 0 V,
f = 1 MHz
VGS = 10 V, VDS = 80 V,
ID = 72 A
VGS = 10 V, VDD = 80 V,
ID = 72 A, RG = 6.2 W
3700
pF
550
200
100
nC
4.0
16
47
5.2
V
3.1
W
16
ns
144
107
157
Forward Diode Voltage
VSD
IS = 72 A
TJ = 25°C
TJ = 125°C
Reverse Recovery Time
trr
Charge Time
Discharge Time
ta
VGS = 0 V, IS = 72 A,
tb
dIS/dt = 100 A/ms
Reverse Recovery Charge
QRR
2. Pulse Test: Pulse Width ≤ 300 ms, Duty Cycle ≤ 2%.
3. Switching characteristics are independent of operating junction temperatures.
0.92
1.3
V
0.86
94
ns
64
30
330
nC
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