NCP1423 Datasheet, PDF (2/13 Pages) ON Semiconductor – 400 mA Sync−Rect PFM Step−Up DC−DC Converter with True−Cutoff and Ring−Killer

NCP1423
0.1 mF
ON
OFF
C1
*
R1
R2
22 mF
C_OUT
100k
EN
LBO
REF
FB
LBI
ADEN
ON
OFF
GND
LX
OUT
BAT
NCP1423
5.6 mH
10 mF
C_IN
* Optional
Figure 1. Typical Operation Circuit
R3
R4
Low battery
open drain output
Low battery
sense input
PIN DESCRIPTION
Pin No.
Symbol
1
EN
2
REF
3
FB
4
GND
5
OUT
6
BAT
7
LX
8
ADEN
9
LBI
10
LBO
Description
Low−Battery Detector Input and Enable. With this pin pulled down below 0.5 V, the device will be disabled
and will enter shutdown mode
1.195 V Reference Voltage Output, bypass with 0.1 mF capacitor if this pin is not loaded, with a 1.0 mF
bypassing capacitor, this pin can be loaded up to 2.5 mA @ V_OUT = 3.3 V.
Output Voltage Feedback Input
Ground
Power Output. OUT provides bootstrap power to the IC
Battery supply input pin and connection for internal Ring−Killer
N−Channel and P−Channel Power MOSFET Drain
Auto Discharge Input
Low−Battery Detector Input
Open−Drain Low−Battery Detector Output. Output is Low when V_LBI is < 500 mV.
LBO is high impedance shutdown
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
Power Supply (Pin 6)
V_OUT
−0.3, 6.0
V
Input / Output Pins (Pins 1−3,5,7−10)
V_IO
−0.3, 6.0
V
Thermal Characteristics
Micro10 Plastic Package, Case 846B, T_A = 25°C
Thermal Resistance Junction−to−Air
P_D
R_qJA
480
mW
250
°C/W
Operating Junction Temperature Range
T_J
− 40 to + 150
°C
Operating Ambient Temperature Range
T_A
− 40 to + 85
°C
Storage Temperature Range
T_stg
− 55 to +150
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
NOTE: ESD data available upon request.
1. This device contains ESD protection and exceeds the following tests:
Human Body Model (HBM) ±2.0 kV per JEDEC standard: JESD22−A114.
Machine Model (MM) ±200 V per JEDEC standard: JESD22−A115.
2. The maximum package power dissipation limit must not be exceeded.
PD
+
TJ(max) *
R_qJA
TA
3. Latchup Current Maximum Rating: ±150 mA per JEDEC standard: JESD78.
4. Moisture Sensitivity Level: MSL 1 per IPC/JEDEC standard: J−STD−020A.
5. Measured on approximately 1 in sq of 1 oz Cu.
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