MMUN2217L Datasheet, PDF (2/5 Pages) ON Semiconductor – Digital Transist

MMUN2217L, NSVMMUN2217L
Table 1. ORDERING INFORMATION
Device
Part Marking
Package
Shipping^†
MMUN2217LT1G
A8M
SC−23
(Pb−Free)
3000 / Tape & Reel
NSVMMUN2217LT1G
A8M
SC−23
(Pb−Free)
3000 / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
300
250
200
(1)
150
(1) SOT−23; Minimum Pad
100
50
0
−50 −25
0 25 50 75 100 125 150
AMBIENT TEMPERATURE (°C)
Figure 1. Derating Curve
Table 2. THERMAL CHARACTERISTICS
Characteristic
THERMAL CHARACTERISTICS (SOT−23) (MMUN2217L)
Total Device Dissipation
T_A = 25°C
Derate above 25°C
Thermal Resistance,
Junction to Ambient
Thermal Resistance,
Junction to Lead
Junction and Storage Temperature Range
1. FR−4 @ Minimum Pad.
2. FR−4 @ 1.0 x 1.0 Inch Pad.
Symbol
Max
Unit
(Note 1)
(Note 2)
(Note 1)
(Note 2)
(Note 1)
(Note 2)
(Note 1)
(Note 2)
P_D
R_qJA
R_qJL
T_J, T_stg
246
400
2.0
3.2
508
311
174
208
−55 to +150
mW
mW/°C
°C/W
°C/W
°C
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