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MC78L00A_15 Datasheet, PDF (2/15 Pages) ON Semiconductor – 100 mA Positive Voltage Regulators | |||
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MC78L00A Series, NCV78L00A
Input
Cin*
0.33 mF
MC78LXXA
Output
CO**
0.1 mF
Figure 2. Standard Application
A common ground is required between the input and the output voltages. The input voltage must remain typically 2.0 V above the output
voltage even during the low point on the input ripple voltage.
* Cin is required if regulator is located an appreciable distance from power supply filter.
** CO is not needed for stability; however, it does improve transient response.
ABSOLUTE MAXIMUM RATINGS
Rating
Symbol
Value
Unit
Input Voltage (5.0 Vâ9.0 V)
Input Voltage (12 Vâ18 V)
Input Voltage (24 V)
VI
30
Vdc
35
40
Storage Temperature Range
Maximum Junction Temperature
Moisture Sensitivity Level
Tstg
â65 to +150
°C
TJ
150
°C
MSL
1
â
ESD Capability, Human Body Model (Note 1)
ESDHBM
2000
V
ESD Capability, Machine Model (Note 1)
ESDMM
200
V
ESD Capability, Charged Device Model (Note 1)
ESDCDM
2000
V
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. This device series incorporates ESD protection and is tested by the following methods:
ESD Human Body Model tested per AECâQ100â002 (EIA/JESD22âA114)
ESD Machine Model tested per AECâQ100â003 (EIA/JESD22âA115)
ESD Charged Device Model tested per EIA/JES D22/C101, Field Induced Charge Model.
THERMAL CHARACTERISTICS
Rating
Symbol
Value
Unit
Package Dissipation
PD
Internally Limited
W
Thermal Characteristics, TOâ92
Thermal Resistance, JunctionâtoâAmbient
RqJA
200
°C/W
Thermal Characteristics, SOIC8
Thermal Resistance, JunctionâtoâAmbient
RqJA
Refer to Figure 8
°C/W
Thermal Characteristics, SOTâ89
Thermal Resistance, JunctionâtoâAmbient
RqJA
55
2. Thermal Resistance, JunctionâtoâAmbient depends on P.C.B. Copper area. See details in Figure 8.
°C/W
Thermal Resistance, JunctionâtoâCase is not defined. SOIC 8 lead and TO-92 packages that do not have a heat sink like other packages
may have. This is the reason that a Theta JC is never specified. A little heat transfer will occur through the package but since it is plastic, it is
minimal. The majority of the heat that is transferred is through the leads where they connect to the circuit board.
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