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MC74VHCT541A_11 Datasheet, PDF (2/7 Pages) ON Semiconductor – Octal Bus Buffer | |||
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MC74VHCT541A
DATA
INPUTS
OUTPUT
ENABLES
2
A1
18
Y1
3
A2
17
Y2
4
A3
16
Y3
5
A4
6
A5
15
Y4
14
Y5
NONINVERTING
OUTPUTS
7
A6
13
Y6
8
A7
12
Y7
9
A8
OE1 1
11
Y8
OE2 19
Figure 1. Logic Diagram
OE1 1
A1 2
A2 3
A3 4
A4 5
A5 6
A6 7
A7 8
A8 9
GND 10
20 VCC
19 OE2
18 Y1
17 Y2
16 Y3
15 Y4
14 Y5
13 Y6
12 Y7
11 Y8
Figure 2. Pin Assignment
MAXIMUM RATINGS
ÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃ Symbol
ÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃ VCC
ÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃ Vin
ÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃ Vout
Parameter
DC Supply Voltage
DC Input Voltage
DC Output Voltage
Outputs in 3âState
High or Low State
ÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃ IIK
Input Diode Current
ÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃ IOK
Output Diode Current (VOUT < GND; VOUT > VCC)
ÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃ Iout DC Output Current, per Pin
ÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃ ICC DC Supply Current, VCC and GND Pins
ÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃ PD Power Dissipation in Still Air,
SOIC Packageâ
TSSOP Packageâ
Value
Unit
â 0.5 to + 7.0
V
â 0.5 to + 7.0
V
â 0.5 to + 7.0
V
â 0.5 to VCC + 0.5
â 20
mA
± 20
mA
± 25
mA
± 75
mA
500
mW
450
ÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃ Tstg Storage Temperature
â 65 to + 150
_C
ÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃ Maximum ratings are those values beyond which device damage can occur. Maximum ratings
ÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃ applied to the device are individual stress limit values (not normal operating conditions) and are
not valid simultaneously. If these limits are exceeded, device functional operation is not implied,
damage may occur and reliability may be affected.
â Derating â SOIC Packages: â 7 mW/_C from 65_ to 125_C
TSSOP Package: â 6.1 mW/_C from 65_ to 125_C
This device contains protection
circuitry to guard against damage
due to high static voltages or electric
fields. However, precautions must
be taken to avoid applications of any
voltage higher than maximum rated
voltages to this highâimpedance cir-
cuit. For proper operation, Vin and
Vout should be constrained to the
range GND v (Vin or Vout) v VCC.
Unused inputs must always be
tied to an appropriate logic voltage
level (e.g., either GND or VCC).
Unused outputs must be left open.
RECOMMENDED OPERATING CONDITIONS
ÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃ Symbol
Parameter
ÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃ VCC DCSupplyVoltage
ÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃ Vin
DC Input Voltage
ÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃ Vout DCOutputVoltage
ÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃ TA
Operating Temperature
ÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃÃ tr,tf InputRiseandFallTime
Outputs in 3âState
High or Low State
VCC =5.0V ±0.5V
Min
Max Unit
4.5
5.5
V
0
5.5
V
0
5.5
V
0
VCC
â 40
+ 85 _C
0
20 ns/V
http://onsemi.com
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