MC74VHC244_13 Datasheet, PDF (2/7 Pages) ON Semiconductor – Octal Bus Buffer

MC74VHC244
FUNCTION TABLE
INPUTS
OEA, OEB
A, B
L
L
L
H
H
X
OUTPUTS
YA, YB
L
H
Z
ORDERING INFORMATION
Device
Package
Shipping^†
MC74VHC244DWR2G
SOIC−20 WB
(Pb−Free)
1000/Tape & Reel
MC74VHC244DTG
MC74VHC244DTR2G
NLV74VHC244DTR2G*
TSSOP−20
(Pb−Free)
75 Units/Rail
2500/Tape & Reel
2500/Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP
Capable.
MAXIMUM RATINGS (Note 1)
Symbol
Parameter
Value
Unit
V_CC
V_IN
V_OUT
I_IK
I_OK
I_OUT
I_CC
P_D
Positive DC Supply Voltage
Digital Input Voltage
DC Output Voltage
Input Diode Current
Output Diode Current
DC Output Current, per Pin
DC Supply Current, V_CC and GND Pins
Power Dissipation in Still Air
−0.5 to +7.0
V
−0.5 to +7.0
V
−0.5 to V_CC +0.5
V
−20
mA
$20
mA
$25
mA
$75
mA
SOIC
500
mW
TSSOP
450
T_STG
V_ESD
Storage Temperature Range
ESD Withstand Voltage
−65 to +150
°C
Human Body Model (Note 2)
>2000
V
Machine Model (Note 3)
>200
Charged Device Model (Note 4)
>2000
I_LATCHUP Latchup Performance
Above V_CC and Below GND at 125°C (Note 5)
$300
mA
q_JA
Thermal Resistance, Junction−to−Ambient
SOIC
96
TSSOP
128
°C/W
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. V_in and V_out should be constrained to the range GND v (V_in or V_out) v V_CC. Unused inputs must always be tied to an appropriate logic voltage
level (e.g., either GND or V_CC). Unused outputs must be left open.
2. Tested to EIA/JESD22−A114−A
3. Tested to EIA/JESD22−A115−A
4. Tested to JESD22−C101−A
5. Tested to EIA/JESD78
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