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MC74VHC1GT66_07 Datasheet, PDF (2/10 Pages) ON Semiconductor – SPST (NO) Normally Open Analog Switch | |||
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MC74VHC1GT66, NLVHC1GT66
IN/OUT XA 1
5 VCC
IN/OUT XA 1
OUT/IN YA 2
OUT/IN YA 2
GND 3
4 ON/OFF
CONTROL
GND 3
(SCâ88A, TSOPâ5)
Figure 1. Pinout Diagrams
6 VCC
5 NC
(UDFN6)
4 ON/OFF
CONTROL
ON/OFF CONTROL
X1
IN/OUT XA
1
1
OUT/IN YA
Figure 2. Logic Symbol
MAXIMUM RATINGS
Symbol
Characteristics
VCC DC Supply Voltage
VIN DC Input Voltage
VIS Analog Output Voltage
IIK
Input Diode Current
ICC DC Supply Current, VCC and GND
TSTG Storage Temperature Range
TL
Lead Temperature, 1 mm from Case for 10 Seconds
TJ
Junction Temperature Under Bias
qJA Thermal Resistance
SC70â5 (Note 1)
SOT23â5
Value
â0.5 to +7.0
â0.5 to +7.0
â0.5 to 7.0
â20
+25
*65 to )150
260
)150
350
230
Unit
V
V
V
mA
mA
°C
°C
°C
°C/W
PD Power Dissipation in Still Air at 85°C
SC70â5
150
mW
SOT23â5
200
MSL Moisture Sensitivity
Level 1
FR
VESD
Flammability Rating
ESD Withstand Voltage
Oxygen Index: 28 to 34 UL 94 Vâ0 @ 0.125 in
Human Body Model (Note 2)
u2000
V
Machine Model (Note 3)
u200
Charged Device Model (Note 4)
N/A
ILatchup Latchup Performance
Above VCC and Below GND at 125°C (Note 5)
$500
mA
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Measured with minimum pad spacing on an FR4 board, using 10 mmâbyâ1 inch, 2âounce copper trace with no air flow.
2. Tested to EIA/JESD22âA114âA.
3. Tested to EIA/JESD22âA115âA.
4. Tested to JESD22âC101âA.
5. Tested to EIA/JESD78.
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