MC74VHC1GT08 Datasheet, PDF (2/8 Pages) ON Semiconductor – 2-Input AND Gate/CMOS Logic Level Shifter

MC74VHC1GT08
MAXIMUM RATINGS (Note 1)
Symbol
Characteristics
Value
Unit
VCC
VIN
VOUT
DC Supply Voltage
DC Input Voltage
DC Output Voltage
–0.5 to +7.0
V
–0.5 to +7.0
V
VCC = 0
–0.5 to 7.0
V
High or Low State
–0.5 to VCC + 0.5
IIK
IOK
IOUT
ICC
PD
q_JA
TL
TJ
Tstg
VESD
Input Diode Current
Output Diode Current
DC Output Current, per Pin
DC Supply Current, VCC and GND
Power dissipation in still air
Thermal resistance
Lead temperature, 1 mm from case for 10 s
Junction temperature under bias
Storage temperature
ESD Withstand Voltage
VOUT < GND; VOUT > VCC
SC–88A, TSOP–5
SC–88A, TSOP–5
Human Body Model (Note 2)
Machine Model (Note 3)
Charged Device Model (Note 4)
–20
+20
+25
+50
200
333
260
+150
–65 to +150
> 2000
> 200
N/A
mA
mA
mA
mA
mW
_C/W
°C
°C
°C
V
ILatch–Up Latch–Up Performance
Above VCC and Below GND at 125°C (Note 5)
±500
mA
1. Maximum Ratings are those values beyond which damage to the device may occur. Exposure to these conditions or conditions beyond those
indicated may adversely affect device reliability. Functional operation under absolute–maximum–rated conditions is not implied. Functional
operation should be restricted to the Recommended Operating Conditions.
2. Tested to EIA/JESD22–A114–A
3. Tested to EIA/JESD22–A115–A
4. Tested to JESD22–C101–A
5. Tested to EIA/JESD78
RECOMMENDED OPERATING CONDITIONS
Symbol
Characteristics
Min
VCC
VIN
VOUT
DC Supply Voltage
DC Input Voltage
DC Output Voltage
3.0
0.0
VCC = 0
0.0
High or Low State
0.0
TA
tr , tf
Operating Temperature Range
Input Rise and Fall Time
–55
VCC = 3.3 V ± 0.3 V
0
VCC = 5.0 V ± 0.5 V
0
Max
5.5
5.5
5.5
VCC
+125
100
20
Unit
V
V
V
°C
ns/V
DEVICE JUNCTION TEMPERATURE VERSUS
TIME TO 0.1% BOND FAILURES
Junction
Temperature °C
Time, Hours
Time, Years
80
1,032,200
117.8
90
419,300
47.9
100
178,700
20.4
110
79,600
9.4
120
37,000
4.2
130
17,800
2.0
140
8,900
1.0
FAILURE RATE OF PLASTIC = CERAMIC
UNTIL INTERMETALLICS OCCUR
1
1
10
100
1000
TIME, YEARS
Figure 3. Failure Rate vs. Time
Junction Temperature
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2