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MC74VHC1GT00DFT2G Datasheet, PDF (2/6 Pages) ON Semiconductor – Single 2-Input NAND Gate/ CMOS Logic Level Shifter | |||
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MC74VHC1GT00
MAXIMUM RATINGS
Symbol
Characteristics
Value
Unit
VCC
VIN
VOUT
IIK
IOK
IOUT
ICC
TSTG
TL
TJ
qJA
DC Supply Voltage
DC Input Voltage
DC Output Voltage
VCC = 0
High or Low State
Input Diode Current
Output Diode Current
DC Output Current, per Pin
VOUT < GND; VOUT > VCC
DC Supply Current, VCC and GND
Storage Temperature Range
Lead Temperature, 1 mm from Case for 10 Seconds
Junction Temperature Under Bias
Thermal Resistance
SC70â5/SCâ88A/SOTâ353 (Note 1)
SOT23â5/TSOPâ5/SC59â5
â0.5 to +7.0
â0.5 to +7.0
â0.5 to 7.0
â0.5 to VCC + 0.5
â20
+20
+25
+50
*65 to )150
260
)150
350
230
V
V
V
mA
mA
mA
mA
_C
_C
_C
_C/W
PD
Power Dissipation in Still Air at 85_C
SC70â5/SCâ88A/SOTâ353
150
mW
SOT23â5/TSOPâ5/SC59â5
200
MSL Moisture Sensitivity
Level 1
FR
VESD
Flammability Rating
ESD Withstand Voltage
Oxygen Index: 28 to 34 UL 94 Vâ0 @ 0.125 in
Human Body Model (Note 2)
u2000
V
Machine Model (Note 3)
u200
Charged Device Model (Note 4)
N/A
ILATCHUP Latchup Performance
Above VCC and Below GND at 125_C (Note 5)
$500
mA
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Measured with minimum pad spacing on an FR4 board, using 10 mmâbyâ1 inch, 2âounce copper trace with no air flow.
2. Tested to EIA/JESD22âA114âA.
3. Tested to EIA/JESD22âA115âA.
4. Tested to JESD22âC101âA.
5. Tested to EIA/JESD78.
RECOMMENDED OPERATING CONDITIONS
Symbol
Characteristics
VCC
VIN
VOUT
DC Supply Voltage
DC Input Voltage
DC Output Voltage
TA
Operating Temperature Range
tr , tf Input Rise and Fall Time
Min
3.0
0.0
VCC = 0
0.0
High or Low State
0.0
â55
VCC = 3.3 V ± 0.3 V
0
VCC = 5.0 V ± 0.5 V
0
Max
5.5
5.5
5.5
VCC
+125
100
20
Unit
V
V
V
°C
ns/V
Device Junction Temperature versus
Time to 0.1% Bond Failures
Junction
Temperature °C
Time, Hours
80
1,032,200
90
419,300
100
178,700
110
79,600
120
37,000
130
17,800
140
8,900
Time, Years
117.8
47.9
20.4
9.4
4.2
2.0
1.0
FAILURE RATE OF PLASTIC = CERAMIC
UNTIL INTERMETALLICS OCCUR
1
1
10
100
1000
TIME, YEARS
Figure 3. Failure Rate vs. Time Junction Temperature
http://onsemi.com
2
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