MC74VHC1G66_07 Datasheet, PDF (2/10 Pages) ON Semiconductor – SPST (NO) Normally Open Analog Switch

MC74VHC1G66, NLVHC1G66
IN/OUT X_A 1
5 V_CC
IN/OUT X_A 1
OUT/IN Y_A 2
OUT/IN Y_A 2
GND 3
4 ON/OFF
CONTROL
GND 3
(SC−88A, TSOP−5)
Figure 1. Pinout Diagrams
6 V_CC
5 NC
(UDFN6)
4 ON/OFF
CONTROL
ON/OFF CONTROL
IN/OUT X_A
X1
1
1
Figure 2. Logic Symbol
OUT/IN
Y_A
MAXIMUM RATINGS
Symbol
Characteristics
Value
Unit
V_CC
V_IN
V_IS
I_IK
I_CC
T_STG
T_L
T_J
q_JA
DC Supply Voltage
Digital Input Voltage
Analog Output Voltage
Digital Input Diode Current
DC Supply Current, V_CC and GND
Storage Temperature Range
Lead Temperature, 1 mm from Case for 10 Seconds
Junction Temperature Under Bias
Thermal Resistance
SC70−5 (Note 1)
SOT23−5
−0.5 to +7.0
−0.5 to +7.0
−0.5 to V_CC +0.5
−20
+25
*65 to )150
260
)150
350
230
V
V
V
mA
mA
°C
°C
°C
°C/W
P_D
Power Dissipation in Still Air at 85°C
SC70−5
150
mW
SOT23−5
200
MSL
Moisture Sensitivity
Level 1
F_R
V_ESD
Flammability Rating
ESD Withstand Voltage
Oxygen Index: 28 to 34
UL 94 V−0 @ 0.125 in
Human Body Model (Note 2)
u2000
V
Machine Model (Note 3)
u200
Charged Device Model (Note 4)
N/A
I_LATCHUP Latchup Performance
Above V_CC and Below GND at 125°C (Note 5)
$500
mA
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2−ounce copper trace with no air flow.
2. Tested to EIA/JESD22−A114−A.
3. Tested to EIA/JESD22−A115−A.
4. Tested to JESD22−C101−A.
5. Tested to EIA/JESD78.
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