MC74VHC1G09_07 Datasheet, PDF (2/6 Pages) ON Semiconductor – 2−Input AND Gate with Open Drain Output

MC74VHC1G09
MAXIMUM RATINGS
Symbol
Characteristics
Value
Unit
V_CC
V_IN
V_OUT
I_IK
I_OK
I_OUT
I_CC
P_D
q_JA
T_L
T_J
T_stg
MSL
DC Supply Voltage
DC Input Voltage
DC Output Voltage
Input Diode Current
Output Diode Current
DC Output Current, per Pin
DC Supply Current, V_CC and GND
Power dissipation in still air
Thermal resistance
Lead temperature, 1 mm from case for 10 s
Junction temperature under bias
Storage temperature
Moisture Sensitivity
SC−88A, TSOP−5
SC−88A, TSOP−5
−0.5 to +7.0
−0.5 to +7.0
−0.5 to 7.0
−20
+20
+25
+50
200
333
260
+150
−65 to +150
Level 1
V
V
V
mA
mA
mA
mA
mW
°C/W
°C
°C
°C
F_R
V_ESD
Flammability Rating
ESD Withstand Voltage
Oxygen Index: 28 to 34 UL 94 V−0 @ 0.125 in
Human Body Model (Note 1)
> 2000
V
Machine Model (Note 2)
> 200
Charged Device Model (Note 3)
N/A
I_Latchup Latchup Performance
Above V_CC and Below GND at 125°C (Note 4)
±500
mA
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Tested to EIA/JESD22−A114−A
2. Tested to EIA/JESD22−A115−A
3. Tested to JESD22−C101−A
4. Tested to EIA/JESD78
RECOMMENDED OPERATING CONDITIONS
Symbol
V_CC
V_IN
V_OUT
T_A
t_r, t_f
Characteristics
DC Supply Voltage
DC Input Voltage
DC Output Voltage
Operating Temperature Range
Input Rise and Fall Time
V_CC = 3.3 V ± 0.3 V
V_CC = 5.0 V ± 0.5 V
Device Junction Temperature versus
Time to 0.1% Bond Failures
Junction
Temperature °C
Time, Hours
80
1,032,200
90
419,300
100
178,700
110
79,600
120
37,000
130
17,800
140
8,900
Time, Years
117.8
47.9
20.4
9.4
4.2
2.0
1.0
Min
Max
Unit
2.0
5.5
V
0.0
5.5
V
0.0
7.0
V
−55
+125
°C
0
100
ns/V
0
20
FAILURE RATE OF PLASTIC = CERAMIC
UNTIL INTERMETALLICS OCCUR
1
1
10
100
1000
TIME, YEARS
Figure 3. Failure Rate vs. Time
Junction Temperature
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