MC74VHC1G03DFT1G Datasheet, PDF (2/6 Pages) ON Semiconductor – Single 2−Input NOR Gate with Open Drain Output

MC74VHC1G03
MAXIMUM RATINGS
Symbol
Characteristics
Value
Unit
V_CC
V_IN
V_OUT
DC Supply Voltage
DC Input Voltage
DC Output Voltage
I_IK
I_OK
I_OUT
I_CC
P_D
Input Diode Current
Output Diode Current
DC Output Current, per Pin
DC Supply Current, V_CC and GND
Power Dissipation in Still Air at 85°C
−0.5 to +7.0
V
−0.5 to +7.0
V
V_CC = 0
−0.5 to 7.0
V
High or Low State
−0.5 to V_CC + 0.5
−20
mA
V_OUT < GND; V_OUT > V_CC
+20
mA
+25
mA
+50
mA
SC70−5/SC−88A
150
mW
TSOP−5
200
q_JA
Thermal Resistance
SC70−5/SC−88A (Note 1)
350
TSOP−5
230
°C/W
T_L
T_J
T_STG
MSL
Lead Temperature, 1 mm from Case for 10 Seconds
Junction Temperature Under Bias
Storage Temperature Range
Moisture Sensitivity
260
°C
)150
°C
*65 to )150
°C
Level 1
F_R
V_ESD
Flammability Rating
ESD Withstand Voltage
Oxygen Index: 28 to 34 UL 94 V−0 @ 0.125 in
Human Body Model (Note 2)
> 2000
V
Machine Model (Note 3)
> 200
Charged Device Model (Note 4)
N/A
I_LATCHUP Latchup Performance
Above V_CC and Below GND at 125°C (Note 5)
$500
mA
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2−ounce copper trace with no air flow.
2. Tested to EIA/JESD22−A114−A.
3. Tested to EIA/JESD22−A115−A.
4. Tested to JESD22−C101−A.
5. Tested to EIA/JESD78.
RECOMMENDED OPERATING CONDITIONS
Symbol
Characteristics
Min
Max
Unit
V_CC
V_IN
V_OUT
T_A
t_r, t_f
DC Supply Voltage
DC Input Voltage
DC Output Voltage
Operating Temperature Range
Input Rise and Fall Time
V_CC = 3.3 V ± 0.3 V
V_CC = 5.0 V ± 0.5 V
DEVICE JUNCTION TEMPERATURE VERSUS
TIME TO 0.1% BOND FAILURES
Junction
Temperature °C
Time, Hours
Time, Years
2.0
5.5
V
0.0
5.5
V
0.0
7.0
V
−55
+125
°C
0
100
ns/V
0
20
FAILURE RATE OF PLASTIC = CERAMIC
UNTIL INTERMETALLICS OCCUR
80
1,032,200
117.8
90
419,300
47.9
100
178,700
20.4
110
79,600
9.4
1
120
37,000
4.2
130
17,800
2.0
140
8,900
1.0
1
10
100
1000
TIME, YEARS
Figure 3. Failure Rate vs. Time Junction Temperature
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