MC74VHC1G02_16 Datasheet, PDF (2/6 Pages) ON Semiconductor – Single 2-Input NOR Gate

MC74VHC1G02
MAXIMUM RATINGS
Symbol
Characteristics
Value
Unit
V_CC
V_IN
V_OUT
I_IK
I_OK
I_OUT
I_CC
P_D
DC Supply Voltage
DC Input Voltage
DC Output Voltage
Input Diode Current
Output Diode Current
DC Output Current, per Pin
DC Supply Current, V_CC and GND
Power Dissipation in Still Air at 85°C
−0.5 to +7.0
V
−0.5 to +7.0
V
V_CC = 0
−0.5 to 7.0
V
High or Low State
−0.5 to V_CC + 0.5
−20
mA
V_OUT < GND; V_OUT > V_CC
+20
mA
+25
mA
+50
mA
SC70−5/SC−88A
150
mW
TSOP−5
200
q_JA
Thermal Resistance
SC70−5/SC−88A (Note 1)
350
TSOP−5
230
°C/W
T_L
Lead Temperature, 1 mm from Case for 10 Seconds
260
°C
T_J
Junction Temperature Under Bias
)150
°C
T_STG
Storage Temperature Range
*65 to )150
°C
V_ESD
ESD Withstand Voltage
Human Body Model (Note 2)
> 2000
V
Machine Model (Note 3)
> 200
Charged Device Model (Note 4)
N/A
I_LATCHUP Latchup Performance
Above V_CC and Below GND at 125°C (Note 5)
$500
mA
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2−ounce copper trace with no air flow.
2. Tested to EIA/JESD22−A114−A.
3. Tested to EIA/JESD22−A115−A.
4. Tested to JESD22−C101−A.
5. Tested to EIA/JESD78.
RECOMMENDED OPERATING CONDITIONS
Symbol
Characteristics
Min
Max
Unit
V_CC DC Supply Voltage
2.0
5.5
V
V_IN
DC Input Voltage
0.0
5.5
V
V_OUT DC Output Voltage
0.0
V_CC
V
T_A
Operating Temperature Range
−55
+125
°C
t_r , t_f Input Rise and Fall Time
V_CC = 3.3 V $ 0.3 V
0
V_CC = 5.0 V $ 0.5 V
0
100
ns/V
20
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
DEVICE JUNCTION TEMPERATURE VERSUS
TIME TO 0.1% BOND FAILURES
Junction
Temperature °C
Time, Hours
Time, Years
FAILURE RATE OF PLASTIC = CERAMIC
UNTIL INTERMETALLICS OCCUR
80
1,032,200
117.8
90
419,300
47.9
100
178,700
20.4
1
110
79,600
9.4
120
37,000
4.2
130
17,800
2.0
1
10
100
1000
TIME, YEARS
140
8,900
1.0
Figure 3. Failure Rate vs. Time Junction Temperature
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