MC74VHC1G01_16 Datasheet, PDF (2/6 Pages) ON Semiconductor – Single 2-Input NAND Gate with Open Drain Output

MC74VHC1G01
MAXIMUM RATINGS
Symbol
Parameter
Value
Unit
V_CC
V_IN
V_OUT
I_IK
I_OK
I_OUT
I_CC
T_STG
T_L
T_J
q_JA
DC Supply Voltage
DC Input Voltage
DC Output Voltage
DC Input Diode Current
DC Output Diode Current
DC Output Sink Current, per Pin
DC Supply Current, V_CC and GND Pin
Storage Temperature Range
Lead Temperature, 1 mm from Case for 10 Seconds
Junction Temperature Under Bias
Thermal Resistance
V_OUT t GND; V_OUT u V_CC
SC70−5/SC−88A (Note 1)
TSOP−5
*0.5 to )7.0
−0.5 to +7.0
*0.5 to V_CC )0.5
−20
$20
25
$25
*65 to )150
260
)150
350
230
V
V
V
mA
mA
mA
mA
°C
°C
°C
°C/W
P_D
Power Dissipation in Still Air at 85°C
SC70−5/SC−88A
150
mW
TSOP−5
200
MSL Moisture Sensitivity
Level 1
F_R
V_ESD
Flammability Rating
ESD Withstand Voltage
Oxygen Index: 28 to 34 UL 94 V−0 @ 0.125 in
Human Body Model (Note 2)
u2000
V
Machine Model (Note 3)
u200
Charged Device Model (Note 4)
N/A
I_LATCHUP Latchup Performance
Above V_CC and Below GND at 125°C (Note 5)
$500
mA
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2−ounce copper trace with no air flow.
2. Tested to EIA/JESD22−A114−A.
3. Tested to EIA/JESD22−A115−A.
4. Tested to JESD22−C101−A.
5. Tested to EIA/JESD78.
RECOMMENDED OPERATING CONDITIONS
Symbol
Characteristics
Min
Max
Unit
V_CC DC Supply Voltage
2.0
5.5
V
V_IN
DC Input Voltage
0.0
5.5
V
V_OUT DC Output Voltage
0.0
7.0
V
T_A
Operating Temperature Range
−55
+125
°C
t_r , t_f Input Rise and Fall Time
V_CC = 3.3 V ± 0.3 V
0
V_CC = 5.0 V ± 0.5 V
0
100
ns/V
20
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
DEVICE JUNCTION TEMPERATURE VERSUS
TIME TO 0.1% BOND FAILURES
Junction
Temperature °C
80
90
100
110
120
130
140
Time, Hours
1,032,200
419,300
178,700
79,600
37,000
17,800
8,900
Time, Years
117.8
47.9
20.4
9.4
4.2
2.0
1.0
FAILURE RATE OF PLASTIC = CERAMIC
UNTIL INTERMETALLICS OCCUR
1
1
10
100
1000
TIME, YEARS
Figure 3. Failure Rate vs. Time Junction Temperature
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2