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MC74LVX541_14 Datasheet, PDF (2/7 Pages) ON Semiconductor – Octal Bus Buffer
MC74LVX541
QE1 1
QE2 19
A1 2
A2 3
A3 4
5
A4
6
A5
7
A6
8
A7
9
A8
&
EN
1
18
Y1
17
Y2
16
Y3
15
Y4
14
Y5
13
Y6
12
Y7
11
Y8
FUNCTION TABLE
Inputs
OE1 OE2 A
Output Y
L
L
L
L
L
L
H
H
HXX
Z
XHX
Z
Figure 2. IEC Logic Diagram
MAXIMUM RATINGS
Symbol
Parameter
Value
Unit
VCC DC Supply Voltage
– 0.5 to + 7.0
V
Vin DC Input Voltage
– 0.5 to + 7.0
V
Vout DC Output Voltage
– 0.5 to VCC + 0.5
V
IIK Input Diode Current
− 20
mA
IOK Output Diode Current
± 20
mA
Iout DC Output Current, per Pin
± 25
mA
ICC DC Supply Current, VCC and GND Pins
± 50
mA
PD Power Dissipation in Still Air,
SOIC Packages†
500
mW
TSSOP Package†
450
Tstg Storage Temperature
– 65 to + 150
°C
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of
these limits are exceeded, device functionality should not be assumed, damage may occur and
reliability may be affected.
†Derating: SOIC Package: –7 mW/°C from 65° to 125°C
TSSOP Package: −6.1 mW/°C from 65° to 125°C
This device contains protection
circuitry to guard against damage
due to high static voltages or electric
fields. However, precautions must
be taken to avoid applications of any
voltage higher than maximum rated
voltages to this high−impedance cir-
cuit. For proper operation, Vin and
Vout should be constrained to the
range GND v (Vin or Vout) v VCC.
Unused inputs must always be
tied to an appropriate logic voltage
level (e.g., either GND or VCC).
Unused outputs must be left open.
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
Min
Max
Unit
VCC DC Supply Voltage
2.0
3.6
V
Vin DC Input Voltage
0
5.5
V
Vout DC Output Voltage
0
VCC
V
TA Operating Temperature, All Package Types
−40
+85
°C
tr, tf Input Rise and Fall Time
VCC = 3.3 V ± 0.3 V
0
100
ns/V
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
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