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MC74LVX04_14 Datasheet, PDF (2/5 Pages) ON Semiconductor – Hex Inverter
MC74LVX04
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VCC DC Supply Voltage
–0.5 to +7.0
V
Vin
DC Input Voltage
–0.5 to +7.0
V
Vout DC Output Voltage
IIK
Input Diode Current
IOK
Output Diode Current
Iout
DC Output Current, per Pin
ICC
DC Supply Current, VCC and GND Pins
–0.5 to VCC +0.5
V
−20
mA
±20
mA
±25
mA
±50
mA
PD
Power Dissipation
180
mW
Tstg
Storage Temperature
–65 to +150
°C
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
Min
Max
Unit
VCC
Vin
Vout
TA
Dt/DV
DC Supply Voltage
DC Input Voltage
DC Output Voltage
Operating Temperature, All Package Types
Input Rise and Fall Time
2.0
3.6
V
0
5.5
V
0
VCC
V
−40
+85
°C
0
100
ns/V
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ DC ELECTRICAL CHARACTERISTICS
Symbol
Parameter
VCC
Test Conditions
(V)
TA = 25°C
Min
Typ
Max
TA = −40 to 85°C
Min
Max
Unit
VIH High−Level Input Voltage
2.0
1.5
3.0
2.0
3.6
2.4
1.5
V
2.0
2.4
VIL Low−Level Input Voltage
2.0
0.5
0.5
V
3.0
0.8
0.8
3.6
0.8
0.8
VOH High−Level Output Voltage
IOH = −50 mA
2.0
1.9
2.0
1.9
V
(Vin = VIH or VIL)
IOH = −50 mA
3.0
2.9
3.0
2.9
IOH = −4 mA
3.0
2.58
2.48
VOL Low−Level Output Voltage
IOL = 50 mA
2.0
(Vin = VIH or VIL)
IOL = 50 mA
3.0
IOL = 4 mA
3.0
0.0
0.1
0.0
0.1
0.36
0.1
V
0.1
0.44
Iin
Input Leakage Current
Vin = 5.5 V or GND 3.6
±0.1
±1.0
mA
ICC Quiescent Supply Current
Vin = VCC or GND
3.6
2.0
20.0
mA
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
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