LE25S20XA Datasheet, PDF (2/24 Pages) ON Semiconductor – Serial Flash Memory

Package Dimensions
unit : mm
WLCSP8, 1.55x1.53
CASE 567NN
ISSUE O
LE25S20XA
PIN A1
REFERENCE
E
AB
2X
0.05 C
2X
0.05 C _{TOP VIEW}
D
A
A1
0.08 C
NOTE 3
SIDE VIEW
C
SEATING
PLANE
8X b ^e/2
0.05 M C A B
C
B
A
e
e
12 3
BOTTOM VIEW
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. COPLANARITY APPLIES TO SPHERICAL CROWNS
OF THE SOLDER BALLS.
4. DATUM C, THE SEATING PLANE, IS DEFINED BY
THE SPHERICAL CROWNS OF THE SOLDER
BALLS.
5. DIMENSION b IS MEASURED AT THE MAXIMUM
SOLDER BALL DIAMETER PARALLEL TO DATUM C.
MILLIMETERS
DIM MIN MAX
A
0.33
A1 0.03 0.13
b 0.20 0.30
D
1.55 BSC
E
1.53 BSC
e
0.40 BSC
RECOMMENDED
SOLDERING FOOTPRINT*
4X
0.400
A1
PACKAGE
OUTLINE
0.40
PITCH
0.200
PITCH
8X
0.25
DIMENSIONS: MILLIMETERS
*For additional information on our Pb-Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
Figure 1 Ball Assignments
Ball No.
A1
A2
A3
B1
B2
C1
C2
C3
Symbol
VDD
HOLD
CS
SCK
SO
SI
WP
VSS
Pin Name
Power supply
Hold
Chip select
Serial clock
Serial data output
Serial data input
Write protect
Ground
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