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ESDR7534 Datasheet, PDF (2/5 Pages) ON Semiconductor – Low Capacitance TVS for LVDS Interfaces
ESDR7534
ELECTRICAL CHARACTERISTICS
(TA = 25°C unless otherwise noted)
Symbol
Parameter
IPP
Maximum Reverse Peak Pulse Current
VC
Clamping Voltage @ IPP
VRWM Working Peak Reverse Voltage
IR
Maximum Reverse Leakage Current @ VRWM
VBR Breakdown Voltage @ IT
IT
Test Current
IF
Forward Current
VF
Forward Voltage @ IF
Ppk Peak Power Dissipation
C
Capacitance @ VR = 0 and f = 1.0 MHz
*See Application Note AND8308/D for detailed explanations of
datasheet parameters.
I
IF
VC VBR VRWM
IIRT VF
V
IPP
Uni−Directional TVS
ELECTRICAL CHARACTERISTICS (TA=25°C unless otherwise specified)
Parameter
Symbol
Conditions
Min
Typ
Max Unit
Reverse Working Voltage
VRWM (Note 1)
5.0
V
Breakdown Voltage
VBR IT = 1 mA, (Note 2)
6.0
8.0
9.5
V
Reverse Leakage Current
IR
VRWM = 5 V
3.0
mA
Forward Voltage
VF
IF = 100 mA
1.6
V
Clamping Voltage
VC
IPP = 10 A (2 x 10 ms Waveform)
30
V
Maximum Peak Pulse Current
IPP
2 x 10 ms Waveform
10
A
Junction Capacitance
CJ
VR = 0 V, f = 1 MHz between I/O Pins and GND
1.3
2.0
pF
Junction Capacitance
CJ
VR = 0 V, f = 1 MHz between I/O Pins, VP floating
0.7
1.0
pF
1. TVS devices are normally selected according to the working peak reverse voltage (VRWM), which should be equal or greater than the DC
or continuous peak operating voltage level.
2. VBR is measured at pulse test current IT.
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
15.0
tr = rise time to peak value [2 ms]
Peak
tf = decay time to half value [10 ms]
12.5
100
Value
10.0
7.5
50
Half Value
5.0
0
0 tr
tf
TIME (ms)
Figure 1. Exponential Decay Pulse Waveform
2.5
0
0 2 4 6 8 10 12 14 16 18 20
Ipp (A)
Figure 2. Clamping Voltage vs. Peak Pulse
Current (tp = 2 x 10 ms, R = 8 W)
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