CS5304 Datasheet, PDF (2/19 Pages) ON Semiconductor – Three-Phase Buck Controller

CS5304
+12 V
+5.0 V
D1
BAT54S
D3
BAT54S
D2
BAS16LT1
C12
1.0 nF
R10
10 K
C1
1.0 mF
C3
1.0 mF
C2
1.0 mF
C10
470 pF
R9
19.1 k
C11
1.0 nF
R8
80.6 k
R11
10 k
+5.0 V
PWRGD
V_ID0
V_ID1
V_ID2
V_ID3
V_ID4
R12
20 K
R5
R6
30 k
30 k
C6
.01 mF
CS1
CS2
C4
0.1 mF
R3
56.2 K
U1
COMP
V_FB
V_DRP
CS1
CS2
CS3
CS_REF
PWRGD
V_ID0
V_ID1
V_ID2
V_ID3
V_ID4
PWRGDS
I_LIM
REF
R_OSC
V_CCL
V_CCL1
Gate(L)1
GND1
Gate(H)1
V_CCH12
Gate(H)2
GND2
Gate(L)2
V_CCL23
Gate(L)3
GND3
Gate(H)3
V_CCH3
LGND
C7
.01 mF
R1
3.09 k
R2
1.40 k
R7
30 k
CS3
C8
.01 mF
C5
0.1 mF
+5.0 V
R4
1.0 W
C14
1.0 mF
+12 V
L4
300 nH
+ _C15,16
2 × 16SP180M
Q1 ^CS1
L1
1.0 mF
Q2
C17−24
8 × 4SP560M
Q3 _CS2
L2
1.0 mF
Q4
C25−32
8 × 10 mF
Q5 _CS3
L3
1.0 mF
Q6
V_CORE
C9
.01 mF
Q1−Q6, NTB85N03 or NTB85N03T4 by ON Semiconductor
Figure 1. Application Diagram for Intel Pentium® 4 Processor 12 V to 1.7 V, 42 A
MAXIMUM RATINGS*
Rating
Value
Unit
Operating Junction Temperature
150
°C
Storage Temperature Range
−65 to +150
°C
ESD Susceptibility (Human Body Model)
2.0
kV
Thermal Resistance, Junction−to−Case, R_qJC
14
°C/W
Thermal Resistance, Junction−to−Ambient, R_qJA
70
°C/W
Lead Temperature Soldering:
Reflow: (SMD styles only) (Note 1)
230 peak
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. 60 second maximum above 183°C.
*The maximum package power dissipation must be observed.
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