CM1681 Datasheet, PDF (2/4 Pages) ON Semiconductor – 2 Channel EMI Filter with ESD Protection

Table 1. PIN DESCRIPTIONS
8−Lead CUDFN Package
Pin
Name
Description
1
Filter #1 Filter #1
2
NC
No connect
3
NC
No connect
4
Filter #2 Filter #2
5
Filter #2 Filter #2
6
NC
No connect
7
NC
No connect
8
Filter #1 Filter #1
GND
PAD
GND Ground
CM1681
PACKAGE / PINOUT DIAGRAMS
Top View
(Pins Down View)
8765
Bottom View
(Pins Up View)
123 4
Pin 1
Marking
GND
PAD
1234
876 5
8−Lead CUDFN Package
SPECIFICATIONS
Table 2. ABSOLUTE MAXIMUM RATINGS
Parameter
Rating
Units
Storage Temperature Range
−65 to +150
°C
DC package power rating
0.5
W
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
Table 3. STANDARD OPERATING CONDITIONS
Parameter
Operating Temperature Range
Rating
−40 to +85
Units
°C
Table 4. ELECTRICAL OPERATING CHARACTERISTICS (Note 1)
Symbol
Parameter
Conditions
Min Typ Max Units
R
Resistance R
8
10
12
W
R_MATCH
C_TOT
C
Resistor−to−Resistor Matching
Total Channel Capacitance
Capacitance C
5
%
2.5 V DC; 1 MHz, 30 mV AC 160 200 240
pF
100
pF
I_LEAK
V_SIG
V_ESD
Diode Leakage Current
Signal Clamp Voltage
Positive Clamp
Negative Clamp
In−system ESD Withstand Voltage:
a) Human Body Model, MIL−STD−883, Method 3015
b) Contact Discharge per IEC 61000−4−2 Level 4
V_IN = ±5.0 V
I_LOAD = 10 mA
I_LOAD = −10 mA
(Note 2)
0.1 1.0
mA
V
5
7
15
−15 −10 −5
kV
±15
±8
f_C
Cut−off frequency
Z_SOURCE = 50 W, Z_LOAD = 50 W
R = 10 W, C = 100 pF
31
MHz
1. T_A = 25°C unless otherwise specified.
2. ESD applied to input and output pins with respect to GND, one at a time. Clamping voltage is measured at the opposite side of the EMI filter
to the ESD pin (i.e. if ESD is applied to pin 1 then clamping voltage is measured at pin 8).
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