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CAT6221_12 Datasheet, PDF (2/10 Pages) ON Semiconductor – 300 mA CMOS Dual LDO Regulator
CAT6221
VIN
VIN EN1
VIN
2.3 V to 5.5 V
CIN
1 mF
VIN VOUT1
CAT6221
OFF ON
OFF ON
EN1 VOUT2
EN2 GND
COUT1
1 mF
VOUT1
EN2
Reference
VOUT2
COUT2
1 mF
LDO1
EN1
Shutdown
Switch
VOUT1
VOUT1
LDO2
EN2
Shutdown
Switch
GND
VOUT2
VOUT2
Figure 1. Typical Application Circuit
Figure 2. CAT6221 Functional Block Diagram
Pin Function
VIN is the supply pin for the LDO. A small 1 mF ceramic
bypass capacitor is required between the VIN pin and ground
near the device. When using longer connections to the power
supply, CIN value can be increased without limit. The
operating input voltage range is from 2.3 V to 5.5 V.
EN1 & 2 are the enable control logic (active high) for the
regulator outputs.
VOUT1 & 2 are the LDO regulator outputs. A small 1 mF
ceramic bypass capacitor is required between the VOUT
pins and ground. For better transient response, its value can
be increased to 4.7 mF.
The capacitor should be located near the device. For the
TSOT23 6−lead package, a continuous 300 mA output
current for both LDOs may turn−on the thermal protection.
On each output, a 250 W internal shutdown switch
discharges the output capacitor in the no−load condition.
GND is the ground reference for the LDO. The pin must be
connected to the ground plane on the PCB.
Table 1. ABSOLUTE MAXIMUM RATINGS
Parameter
Rating
Unit
VIN
VEN, VOUT
Junction Temperature, TJ
Power Dissipation, PD
Storage Temperature Range, TS
Lead Temperature (soldering, 5 sec.)
0 to 6.5
V
−0.3 to VIN + 0.3
V
+150
_C
Internally Limited (Note 1)
mW
−65 to +150
_C
260
_C
ESD Rating (Human Body Model)
3
kV
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
Table 2. RECOMMENDED OPERATING CONDITIONS (Note 2)
Parameter
Range
Unit
VIN
2.3 to 5.5
V
VEN
0 to VIN
V
Junction Temperature Range, TJ
−40 to +125
_C
Package Thermal Resistance (TSOT23), θJA
235
_C/W
NOTE: Typical application circuit with external components is shown above.
1. The maximum allowable power dissipation at any TA (ambient temperature) is PDmax = (TJmax − TA)/qJA. Exceeding the maximum allowable
power dissipation will result in excessive die temperature, and the regulator will go into thermal shutdown.
2. The device is not guaranteed to work outside its operating rating.
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