CAT6095_11 Datasheet, PDF (2/15 Pages) ON Semiconductor – Digital Output Temperature Sensor

CAT6095
Table 1. ABSOLUTE MAXIMUM RATINGS
Parameter
Rating
Units
Operating Temperature
−45 to +130
°C
Storage Temperature
−65 to +150
°C
Voltage on any pin with respect to Ground (Note 1)
−0.5 to +6.5
V
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. The DC input voltage on any pin should not be lower than −0.5 V or higher than V_CC + 0.5 V. The A₀ pin can be raised to a HV level compatible
with the use of a DDR3 SPD device sharing the bus with the TS. SCL and SDA inputs can be raised to the maximum limit, irrespective of V_CC.
Table 2. TEMPERATURE CHARACTERISTICS (V_CC = 3.3 V ± 10%, T_A = −40°C to +125°C, unless otherwise specified)
Parameter
Test Conditions/Comments
Max
Unit
Temperature Reading Error
Class B, JC42.4 compliant
ADC Resolution
+75°C ≤ T_A ≤ +95°C, active range
+40°C ≤ T_A ≤ +125°C, monitor range
−20°C ≤ T_A ≤ +125°C, sensing range
±1.0
°C
±2.0
°C
±3.0
°C
12
Bits
Temperature Resolution
0.0625
°C
Temperature Conversion Time
100
ms
Thermal Resistance (Note 2) q_JA
Junction−to−Ambient (Still Air)
92
°C/W
2. Power Dissipation is defined as P_J = (T_J − T_A)/q_JA, where T_J is the junction temperature and T_A is the ambient temperature. The thermal
resistance value refers to the case of a package being used on a standard 2−layer PCB.
Table 3. D.C. OPERATING CHARACTERISTICS (V_CC = 3.3 V ± 10%, T_A = −40°C to +125°C, unless otherwise specified)
Symbol
Parameter
Test Conditions/Comments
Min
Max
Unit
I_CC
I_SHDN
I_L
V_IL
V_IH
V_OL
Supply Current
I/O Pin Leakage Current
Input Low Voltage
Input High Voltage
Output Low Voltage
TS active
TS shut−down; no bus activity
Pin at GND or V_CC
I_OL = 3 mA, V_CC > 2.5 V
200
mA
10
mA
2
mA
−0.5
0.3 x V_CC
V
0.7 x V_CC
V_CC + 0.5
V
0.4
V
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