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CAT6095 Datasheet, PDF (2/18 Pages) ON Semiconductor – Digital Output Temperature Sensor
CAT6095
ABSOLUTE MAXIMUM RATINGS(1)
Parameter
Operating Temperature
Storage Temperature
Voltage on any pin with respect to Ground(2)
Rating
Unit
-45 to +130
°C
-65 to +150
°C
-0.5 to +6.5
V
TEMPERATURE CHARACTERISTICS
VCC = 3.3 V ± 10%, TA = −40°C to +125°C, unless otherwise specified
Parameter
Test Conditions/Comments
Temperature Reading Error
Class B, JC42.4 compliant
ADC Resolution
Temperature Resolution
Temperature Conversion Time
Thermal Resistance(3) θJA
75°C ≤ TA ≤ 95°C, active range
40°C ≤ TA ≤ 125°C, monitor range
-20°C ≤ TA ≤ 125°C, sensing range
Junction-to-Ambient (Still Air)
D.C. OPERATING CHARACTERISTICS
VCC = 3.3 V ± 10%, TA = −40°C to +125°C, unless otherwise specified
Symbol Parameter
Test Conditions/Comments
ICC
ISHDN
IL
VIL
VIH
VOL
Supply Current
I/O Pin Leakage Current
Input Low Voltage
Input High Voltage
Output Low Voltage
TS active
TS shut-down; no bus activity
Pin at GND or VCC
IOL = 3 mA, VCC > 2.5 V
Max
± 1.0
± 2.0
± 3.0
12
0.0625
100
92
Unit
°C
°C
°C
Bits
°C
ms
ºC/W
Min
-0.5
0.7 x VCC
Max
200
5
5
0.3 x VCC
VCC + 0.5
0.4
Unit
μA
μA
μA
V
V
V
Notes:
(1) Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions outside of those listed in the operational sections of this
specification is not implied. Exposure to any absolute maximum rating for extended periods may affect device performance and reliability.
(2) The DC input voltage on any pin should not be lower than -0.5 V or higher than VCC + 0.5 V. The A0 pin can be raised to a HV level
compatible with the use of a DDR3 SPD device sharing the bus with the TS. SCL and SDA inputs can be raised to the maximum limit,
irrespective of VCC.
(3) Power Dissipation is defined as PJ = (TJ − TA)/θJA, where TJ is the junction temperature and TA is the ambient temperature. The thermal
resistance value refers to the case of a package being used on a standard 2-layer PCB.
Doc. No. MD-1124 Rev. D
2
© 2009 SCILLC. All rights reserved.
Characteristics subject to change without notice