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74HCT08 Datasheet, PDF (2/7 Pages) ON Semiconductor – Quad 2-Input AND Gate With LSTTL−Compatible Inputs High−Performance Silicon−Gate CMOS
74HCT08
ORDERING INFORMATION
Device
Package
Shipping†
74HCT08DR2G
SOIC−14
(Pb−Free)
74HCT08DR2GH
SOIC−14
(Halide−Free)
2500/Tape & Reel
74HCT08DTR2G
TSSOP−14*
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*This package is inherently Pb−Free.
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This device contains protection
VCC DC Supply Voltage (Referenced to GND)
– 0.5 to + 7.0
V
circuitry to guard against damage
due to high static voltages or electric
Vin DC Input Voltage (Referenced to GND)
– 0.5 to + 7.0
V
fields. However, precautions must
Vout DC Output Voltage (Referenced to GND)
– 0.5 to VCC + 0.5 V
be taken to avoid applications of any
voltage higher than maximum rated
Iin
DC Input Current, per Pin
±20
mA
Iout DC Output Current, per Pin
±25
mA
ICC DC Supply Current, VCC and GND Pins
±50
mA
PD Power Dissipation in Still Air,
SOIC Package†
500
mW
TSSOP Package†
450
Tstg Storage Temperature
– 65 to + 150
_C
voltages to this high−impedance cir-
cuit. For proper operation, Vin and
Vout should be constrained to the
range GND v (Vin or Vout) v VCC.
Unused inputs must always be
tied to an appropriate logic voltage
level (e.g., either GND or VCC).
Unused outputs must be left open.
TL Lead Temperature, 1 mm from Case for 10 Seconds
_C
SOIC or TSSOP Package
260
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress
ratings only. Functional operation above the Recommended Operating Conditions is not implied.
Extended exposure to stresses above the Recommended Operating Conditions may affect device
reliability.
†Derating — SOIC Package: – 7 mW/_C from 65_ to 125_C
TSSOP Package: − 6.1 mW/_C from 65_ to 125_C
For high frequency or heavy load considerations, see Chapter 2 of the ON Semiconductor High−Speed CMOS Data Book (DL129/D).
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
Min
VCC DC Supply Voltage (Referenced to GND)
4.5
Vin DC Input Voltage (Referenced to GND)
0
Vout DC Output Voltage (Referenced to GND)
0
TA Operating Temperature, All Package Types
−55
tr, tf Input Rise and Fall Time
(Figure 1)
VCC = 2.0 V
0
VCC = 4.5 V
0
VCC = 6.0 V
0
Max
5.5
5.5
VCC
+125
1000
500
400
Unit
V
V
V
_C
ns
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