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MC34025 Datasheet, PDF (19/20 Pages) ON Semiconductor – High Speed Double-Ended PWM Controller
MC34025 MC33025
OUTLINE DIMENSIONS
FN SUFFIX
PLASTIC PACKAGE
CASE 775–02
(PLCC)
–N–
Y BRK
B
0.007 (0.180) M T L –M S N S
D
U 0.007 (0.180) M T L –M S N S
–L–
–M–
W
Z
D
20
1
V
X
VIEW D–D
G1 0.010 (0.250) S T L –M S N S
A 0.007 (0.180) M T L –M S N S
Z
R 0.007 (0.180) M T L –M S N S
H 0.007 (0.180) M T L –M S N S
C
E
0.004 (0.100)
G
J
–T– SEATING
PLANE
VIEW S
G1
0.010 (0.250) S T L –M S N S
K1
K
F
VIEW S
0.007 (0.180) M T L –M S N S
NOTES:
1. DATUMS –L–, –M–, AND –N– DETERMINED WHERE
TOP OF LEAD SHOULDER EXITS PLASTIC BODY
AT MOLD PARTING LINE.
2. DIM G1, TRUE POSITION TO BE MEASURED AT
DATUM –T–, SEATING PLANE.
3. DIM R AND U DO NOT INCLUDE MOLD FLASH.
ALLOWABLE MOLD FLASH IS 0.010 (0.250) PER
SIDE.
4. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
5. CONTROLLING DIMENSION: INCH.
6. THE PACKAGE TOP MAY BE SMALLER THAN THE
PACKAGE BOTTOM BY UP TO 0.012 (0.300).
DIMENSIONS R AND U ARE DETERMINED AT THE
OUTERMOST EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS,
GATE BURRS AND INTERLEAD FLASH, BUT
INCLUDING ANY MISMATCH BETWEEN THE TOP
AND BOTTOM OF THE PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H
DIMENSION TO BE GREATER THAN 0.037 (0.940).
THE DAMBAR INTRUSION(S) SHALL NOT CAUSE
THE H DIMENSION TO BE SMALLER THAN 0.025
(0.635).
INCHES
MILLIMETERS
DIM MIN MAX MIN MAX
A 0.385 0.395 9.78 10.03
B 0.385 0.395 9.78 10.03
C 0.165 0.180 4.20 4.57
E 0.090 0.110 2.29 2.79
F 0.013 0.019 0.33 0.48
G
0.050 BSC
1.27 BSC
H 0.026 0.032 0.66 0.81
J 0.020 — 0.51 —
K 0.025 — 0.64 —
R 0.350 0.356 8.89 9.04
U 0.350 0.356 8.89 9.04
V 0.042 0.048 1.07 1.21
W 0.042 0.048 1.07 1.21
X 0.042 0.056 1.07 1.42
Y
— 0.020 — 0.50
Z
2° 10°
2° 10°
G1 0.310 0.330 7.88 8.38
K1 0.040 — 1.02 —
MOTOROLA ANALOG IC DEVICE DATA
19