MC34280 Datasheet, PDF (17/20 Pages) ON Semiconductor – Power Supply & Management IC for Handheld Electronic Products

MC34280
1
–T–
B
B1
8
PACKAGE DIMENSIONS
32–LEAD LQFP
FTB SUFFIX
CASE 873A–02
A
A1
32
4X
0.20 (0.008) AB T–U Z
25
BASE
METAL
DETAIL Y
–U–
V
17 ^V1
FÉÉÉNÉÉÉ D
J
9
–AB–
SEATING
PLANE
–AC–
9
–Z–
4X
SECTION AE–AE
S1
0.20 (0.008) AC T–U Z
S
DETAIL AD
G
0.10 (0.004) AC
8X M_
CE
AE
P
R
AE
DETAIL Y
W
H
K ^Q_
X
DETAIL AD
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE –AB– IS LOCATED AT BOTTOM
OF LEAD AND IS COINCIDENT WITH THE LEAD
WHERE THE LEAD EXITS THE PLASTIC BODY AT
THE BOTTOM OF THE PARTING LINE.
4. DATUMS –T–, –U–, AND –Z– TO BE
DETERMINED AT DATUM PLANE –AB–.
5. DIMENSIONS S AND V TO BE DETERMINED AT
SEATING PLANE –AC–.
6. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION. ALLOWABLE PROTRUSION
IS 0.250 (0.010) PER SIDE. DIMENSIONS A AND B
DO INCLUDE MOLD MISMATCH AND ARE
DETERMINED AT DATUM PLANE –AB–.
7. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. DAMBAR PROTRUSION SHALL
NOT CAUSE THE D DIMENSION TO EXCEED
0.520 (0.020).
8. MINIMUM SOLDER PLATE THICKNESS SHALL
BE 0.0076 (0.0003).
9. EXACT SHAPE OF EACH CORNER MAY VARY
FROM DEPICTION.
MILLIMETERS
DIM MIN MAX
A 7.000 BSC
A1 3.500 BSC
B 7.000 BSC
B1 3.500 BSC
C 1.400 1.600
D 0.300 0.450
E 1.350 1.450
F 0.300 0.400
G 0.800 BSC
H 0.050 0.150
J 0.090 0.200
K 0.500 0.700
M
12_ REF
N 0.090 0.160
P 0.400 BSC
Q
1_
5_
R 0.150 0.250
S 9.000 BSC
S1 4.500 BSC
V 9.000 BSC
V1 4.500 BSC
W 0.200 REF
X 1.000 REF
INCHES
MIN MAX
0.276 BSC
0.138 BSC
0.276 BSC
0.138 BSC
0.055 0.063
0.012 0.018
0.053 0.057
0.012 0.016
0.031 BSC
0.002 0.006
0.004 0.008
0.020 0.028
12_ REF
0.004 0.006
0.016 BSC
1_
5_
0.006 0.010
0.354 BSC
0.177 BSC
0.354 BSC
0.177 BSC
0.008 REF
0.039 REF
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