SA3229 Datasheet, PDF (15/16 Pages) ON Semiconductor – Preconfigured DSP System

RHYTHM SA3229
PACKAGE DIMENSIONS
E
PIN A1
ÈÈÈÈÈÈ ^INDICATOR
2X
0.13 C
2X
0.13 C
TOP VIEW
0.13 C
SIP25, 5.72x3.18
CASE 127DZ
ISSUE O
AB
D
e
20X L
2X L3
A2
2X b1
A
DETAIL A
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. COPLANARITY APPLIES TO THE SPHERICAL
CROWNS OF THE PADS.
3X L2
e1
MILLIMETERS
DIM MIN MAX
A
−−− 1.31
A1 0.07 0.17
A2 −−− 1.14
b 0.478 0.538
b1 0.427 0.487
D
3.18 BSC
E
5.72 BSC
e
0.686 BSC
e1 0.051 BSC
e2 1.067 BSC
e3 1.092 BSC
L 0.554 0.614
L2 0.808 0.868
L3 0.275 0.335
0.05 C
NOTE 3
SIDE VIEW
e
e/2
1
A1
C
SEATING
PLANE
8
DETAIL A
e
e/2
0.686
2X
0.335
0.686
3X
0.868
DETAIL B
e2
e3
17
10
23X b
0.05 C A B
BOTTOM VIEW
0.03 C NOTE 4
12345678
20X
0.614
RECOMMENDED
SOLDERING FOOTPRINT*
2X
23X
0.538
0.487
1.092
1.067
24
18 19 20 21 22 23
9
25
17 16 15 14 13 12 11 10
BOTTOM VIEW
PIN LAYOUT
0.051
A1
0.686
PITCH
DETAIL B
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
www.onsemi.com
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