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MC33201_06 Datasheet, PDF (15/19 Pages) ON Semiconductor – Low Voltage, Rail−to−Rail Operational Amplifiers | |||
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MC33201, MC33202, MC33204, NCV33202, NCV33204
PACKAGE DIMENSIONS
HE
PIN 1 ID e
SEATING
âTâ PLANE
0.038 (0.0015)
D
E
Micro8
DM SUFFIX
CASE 846Aâ02
ISSUE G
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE
BURRS. MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED
0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE.
5. 846Aâ01 OBSOLETE, NEW STANDARD 846Aâ02.
b 8 PL
0.08 (0.003) M T B S A S
A
MILLIMETERS
DIM MIN NOM MAX
A
ââ
ââ
1.10
A1 0.05
0.08
0.15
b
0.25
0.33
0.40
c
0.13
0.18
0.23
D 2.90
3.00
3.10
E 2.90
3.00
3.10
e
0.65 BSC
L
0.40
0.55
0.70
H E 4.75
4.90
5.05
MIN
ââ
0.002
0.010
0.005
0.114
0.114
0.016
0.187
INCHES
NOM
ââ
0.003
0.013
0.007
0.118
0.118
0.026 BSC
0.021
0.193
MAX
0.043
0.006
0.016
0.009
0.122
0.122
0.028
0.199
A1
c
L
1.04
8X 0.041
SOLDERING FOOTPRINT*
0.38
0.015 8X
3.20
0.126
4.24 5.28
0.167 0.208
0.65
6X 0.0256
Ç Ç SCALE 8:1
mm
inches
*For additional information on our PbâFree strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
15
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